Patent Assignment
Reel/Frame 034958/0413
Assignment of Assignor's Interest
Recorded: 2015-02-13
Pages: 3
Assignor
WONG, WING SHENQ
Executed: 2014-12-10
Assignee
STMICROELECTRONICS PTE LTD
28 ANG MO KIO INDUSTRIAL PARK 2,, SINGAPORE,, 569508, SINGAPORE
Covered Property
(1)
Integrated Circuit (Ic) Package with Thick Die Pad Functioning as a Heat Sink
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.