IP Library › Assignment 034649/0134
Patent Assignment
Reel/Frame 034649/0134

Assignment of Assignor's Interest

Recorded: 2014-12-17 Pages: 4
Assignors
LIN, TING-HAO
Executed: 2014-12-17
CHANG, CHIAO-CHENG
Executed: 2014-12-17
LIN, YI-NUNG
Executed: 2014-12-17
Assignee
KINSUS INTERCONNECT TECHNOLOGY CORP.
NO. 1245, JUNGHUA ROAD, SHIN-WU SHIANG, TAOYUAN COUNTY, 327, TAIWAN
Covered Property (1)
Ameliorated Compound Carrier Board Structure of Flip-Chip Chip-Scale Package
Application: 14/572,904 →
Publication: US 2016/0181188