Patent Assignment
Reel/Frame 034652/0193
Assignment of Assignor's Interest
Recorded: 2015-01-07
Pages: 4
Assignors
WANG, ZHIQI
Executed: 2014-12-16
LI, JUNJIE
Executed: 2014-12-16
YANG, YING
Executed: 2014-12-16
YU, QIONG
Executed: 2014-12-16
WANG, WEI
Executed: 2014-12-16
Assignee
CHINA WAFER LEVEL CSP CO., LTD.
NO.29 TINGLAN LANE SIP, SUZHOU, JIANGSU, 215026, CHINA
Covered Property
(1)
Chip to Wafer Package with Top Electrodes and Method of Forming