Patent Assignment
Reel/Frame 034657/0610
Assignment of Assignor's Interest
Recorded: 2015-01-07
Pages: 2
Assignors
YU, CHEN-HUA
Executed: 2014-12-30
CHIOU, WEN-CHIH
Executed: 2014-12-30
LIU, CHUNG-SHI
Executed: 2014-12-30
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6 SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Bonded 3D Integrated Circuit (3DIC) Structure