IP Library Assignment 034660/0990
Patent Assignment
Reel/Frame 034660/0990

Assignment of Assignor's Interest

Recorded: 2015-01-08 Pages: 6
Assignors
CARMON, ROI
Executed: 2014-12-29
ELAD, DANNY
Executed: 2014-12-29
KAMINSKI, NOAM
Executed: 2014-12-29
MARKISH, OFER
Executed: 2014-12-29
MORF, THOMAS
Executed: 2015-01-07
SHUMAKER, EVGENY
Executed: 2014-12-29
Assignee
INTERNATIONAL BUSINESS MACHINES CORPORATION
NEW ORCHARD ROAD, ARMONK, NEW YORK, 10504
Covered Property (1)
Direct Chip to Waveguide Transition Including Ring Shaped Antennas Disposed in a Thinned Periphery of the Chip
Patent: 9,564,671 →
Application: 14/583,715 →
Publication: US 2016/0190671
Related Assignments (5)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jan 17, 2017
From: INTERNATIONAL BUSINESS MACHINES CORPORATION
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 040985/0119 →
Patent Security Agreement Jun 22, 2018
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 046410/0933 →
Release of Security Interest Oct 1, 2021
From: DEUTSCHE BANK AG NEW YORK BRANCH
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 057674/0203 →
Assignment of Assignor's Interest Aug 8, 2022
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: AY DEE KAY LLC DBA INDIE SEMICONDUCTOR
Reel/Frame 060744/0472 →
Release of Security Interest in Patents Recorded at Recorded at Reel 046410, Frame 0933 Jun 22, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 064072/0001 →