Patent Assignment
Reel/Frame 034667/0828
Assignment of Assignor's Interest
Recorded: 2015-01-08
Pages: 4
Assignors
HO, YEN-SHIH
Executed: 2014-12-04
LIU, TSANG-YU
Executed: 2014-12-04
CHANG, SHU-MING
Executed: 2014-12-04
HUANG, YU-LUNG
Executed: 2014-12-04
LIN, CHAO-YEN
Executed: 2014-12-04
SUEN, WEI-LUEN
Executed: 2014-12-04
CHEN, CHIEN-HUI
Executed: 2014-12-04
Assignee
XINTEC INC.
9F., NO. 23, JILIN RD., JHONGLI INDUSTRIAL PARK, JHONGLI CITY, TAOYUAN COUNTY, 32062, TAIWAN
Covered Property
(1)
Stacked Chip Package and Method for Forming the Same