Patent Assignment
Reel/Frame 034668/0614
Assignment of Assignor's Interest
Recorded: 2015-01-08
Pages: 4
Assignors
HUANG, CHIH-HUI
Executed: 2014-12-19
CHU, YEN-CHANG
Executed: 2014-12-19
LIU, KUAN-LIANG
Executed: 2014-12-19
LIU, PING-YIN
Executed: 2014-12-19
TSAI, CHENG-YUAN
Executed: 2014-12-19
TU, YEUR-LUEN
Executed: 2014-12-19
TSAI, CHIA-SHIUNG
Executed: 2014-12-30
LEE, RU-LIANG
Executed: 2014-12-30
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6 SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Bond Chuck, Methods of Bonding, and Tool Including Bond Chuck