Patent Assignment
Reel/Frame 034674/0963
Assignment of Assignor's Interest
Recorded: 2015-01-09
Pages: 4
Assignors
WEN, TSUNG-YAO
Executed: 2014-12-30
YEONG, SAI-HOOI
Executed: 2014-12-30
LAI, BO-YU
Executed: 2014-12-30
WANG, SHENG-CHEN
Executed: 2014-12-30
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD
NO.8, LI-HSIN ROAD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Semiconductor Structure with Fin Structure and Wire Structure and Method for Forming the Same