Patent Assignment
Reel/Frame 034704/0811
Assignment of Assignor's Interest
Recorded: 2015-01-14
Pages: 4
Assignors
WE, HONG BOK
Executed: 2014-12-22
HWANG, KYU-PYUNG
Executed: 2014-12-22
SONG, YOUNG KYU
Executed: 2015-01-05
KIM, DONG WOOK
Executed: 2014-12-22
Assignee
QUALCOMM INCORPORATED
5775 MOREHOUSE DRIVE, SAN DIEGO, CALIFORNIA, 92121-1714
Covered Property
(1)
Package Substrate Comprising Capacitor, Redistribution Layer and Discrete Coaxial Connection