Patent Assignment
Reel/Frame 034713/0145
Assignment of Assignor's Interest
Recorded: 2015-01-14
Pages: 2
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Integrated Circuit Packages and Methods of Forming Same