Patent Assignment
Reel/Frame 034755/0168
Assignment of Assignor's Interest
Recorded: 2015-01-20
Pages: 6
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, 443-742, KOREA, REPUBLIC OF
Covered Property
(1)
Methods of Forming Semiconductor Devices, Including Forming a Semiconductor Material on a Fin, and Related Semiconductor Devices