IP Library Assignment 034760/0590
Patent Assignment
Reel/Frame 034760/0590

Change of Name

Recorded: 2015-01-13 Pages: 3
Assignor
PREMARK PACKAGING LLC
Executed: 2014-07-02
Assignee
SIGNODE INDUSTRIAL GROUP LLC
3650 WEST LAKE AVE, GLENVIEW, ILLINOIS, 60026
Covered Property (1)
Double Block Honeycomb Panel Void-Filler
Patent: 667,727 →
Application: 29/387,253 →
Related Assignments (6)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Apr 5, 2011
From: DIAZ, JOSEPH A.; BOYSE, GEORGE C.; GUITERREZ, JANE A.
To: ILLINOIS TOOL WORKS INC.
Reel/Frame 026078/0544 →
Assignment of Assignor's Interest Mar 24, 2014
From: ILLINOIS TOOL WORKS INC.
To: PREMARK PACKAGING LLC
Reel/Frame 032513/0423 →
Security Interest May 2, 2014
From: PREMARK PACKAGING LLC
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 032814/0305 →
Release of Security Interest Apr 3, 2018
From: JPMORGAN CHASE BANK, N.A.
To: SIGNODE INDUSTRIAL GROUP LLC
Reel/Frame 045825/0133 →
Security Agreement Apr 4, 2018
From: SIGNODE INDUSTRIAL GROUP LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 045833/0485 →
Release of Security Interest Nov 14, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH
To: CROWN PACKAGING TECHNOLOGY, INC.; SIGNODE INDUSTRIAL GROUP LLC
Reel/Frame 065564/0736 →