IP Library › Granted Patent US 667,727
Granted Patent S1
US 667,727 · App. 29/387,253 · Granted Sep 25, 2012

Double block honeycomb panel void-filler

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Quick Facts
Patent No.
US 667,727
App. No.
29/387,253
Granted
Sep 25, 2012
Kind
S1
Claims (1)

The ornamental design for a double block honeycomb panel void-filler, as shown and described.

Assignments (7)
RELEASE OF SECURITY INTEREST Recorded Nov 14, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH
To: CROWN PACKAGING TECHNOLOGY, INC.; SIGNODE INDUSTRIAL GROUP LLC
Reel/Frame 065564/0736 →
SECURITY AGREEMENT Recorded Apr 4, 2018
From: SIGNODE INDUSTRIAL GROUP LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 045833/0485 →
RELEASE OF SECURITY INTEREST Recorded Apr 3, 2018
From: JPMORGAN CHASE BANK, N.A.
To: SIGNODE INDUSTRIAL GROUP LLC
Reel/Frame 045825/0133 →
CHANGE OF NAME Recorded Jan 13, 2015
From: PREMARK PACKAGING LLC
To: SIGNODE INDUSTRIAL GROUP LLC
Reel/Frame 034760/0590 →
SECURITY INTEREST Recorded May 2, 2014
From: PREMARK PACKAGING LLC
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 032814/0305 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 24, 2014
From: ILLINOIS TOOL WORKS INC.
To: PREMARK PACKAGING LLC
Reel/Frame 032513/0423 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 5, 2011
From: DIAZ, JOSEPH A.; BOYSE, GEORGE C.; GUITERREZ, JANE A.
To: ILLINOIS TOOL WORKS INC.
Reel/Frame 026078/0544 →