Patent Assignment
Reel/Frame 034781/0949
Assignment of Assignor's Interest
Recorded: 2015-01-20
Pages: 7
Assignors
HA, YONGDAE
Executed: 2014-09-29
LEE, JAERYOUNG
Executed: 2014-09-29
KIM, CHULMIN
Executed: 2014-09-29
HWANG, YISUNG
Executed: 2014-09-30
UM, TEASEOG
Executed: 2014-09-29
JUNG, YONGJIN
Executed: 2014-09-29
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129 SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 443-742, KOREA, REPUBLIC OF
Covered Property
(1)
Die Bonding Apparatus