Patent Assignment
Reel/Frame 034789/0163
Assignment of Assignor's Interest
Recorded: 2015-01-22
Pages: 3
Assignors
NAITO, TAKASHI
Executed: 2014-11-27
TACHIZONO, SHINICHI
Executed: 2014-12-23
YOSHIMURA, KEI
Executed: 2014-12-23
HASHIBA, YUJI
Executed: 2014-12-23
KODAMA, MOTOMUNE
Executed: 2014-11-27
MIYAGI, MASANORI
Executed: 2014-12-08
AOYAGI, TAKUYA
Executed: 2014-12-04
SAWAI, YUICHI
Executed: 2014-11-29
FUJIEDA, TADASHI
Executed: 2014-11-28
TSUKAMOTO, TAKESHI
Executed: 2014-12-03
MURAKAMI, HAJIME
Executed: 2014-11-27
Assignee
HITACHI CHEMICAL COMPANY, LTD.
9-2, MARUNOCHI 1-CHOME, CHIYODA-KU, TOKYO, JAPAN
Covered Property
(1)
Electronic Component, Method for Producing Same, and Sealing Material Paste Used in Same
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Mar 2, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062917/0865 →
Change of Name
Mar 3, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062946/0125 →
Change of Address
Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →