IP Library › Assignment 034789/0231
Patent Assignment
Reel/Frame 034789/0231

Assignment of Assignor's Interest

Recorded: 2015-01-22 Pages: 14
Assignors
TELGENHOFF, MICHAEL DAVID
Executed: 2014-11-20
ZHOU, XIAOBING
Executed: 2014-11-20
Assignee
DOW CORNING CORPORATION
P.O. BOX 994, MAIL C01232, MIDLAND, MICHIGAN, 48686
Covered Property (1)
Silicon Precursor, Method of Forming a Layer Using the Same, and Method of Fabricating Semiconductor Device Using the Same
Application: 14/602,671 →
Publication: US 2015/0303060
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jan 22, 2015
From: CHO, JUNHYUN; JUNG, KYUNGHYE; CHO, YOUNJOUNG
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 034789/0141 →
Change of Name Mar 29, 2018
From: DOW CORNING CORPORATION
To: DOW SILICONES CORPORATION
Reel/Frame 045381/0992 →