Patent Assignment
Reel/Frame 034813/0344
Assignment of Assignor's Interest
Recorded: 2015-01-26
Pages: 7
Assignors
WAN, TSUNG-WEI
Executed: 2015-01-16
CHEN, WEI-PING
Executed: 2015-01-16
CHIU, JUI-YI
Executed: 2015-01-21
DENG, JAU-JAN
Executed: 2015-01-19
Assignee
OMNIVISION TECHNOLOGIES, INC.
4275 BURTON DRIVE, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Wafer-Level Lens Packaging Methods, and Associated Lens Assemblies and Camera Modules