Patent Assignment
Reel/Frame 034840/0149
Assignment of Assignor's Interest
Recorded: 2015-01-29
Pages: 4
Assignors
YU, CHEN-HUA
Executed: 2010-09-29
CHANG, HUNG-PIN
Executed: 2010-09-29
LIN, YUNG-CHI
Executed: 2010-09-29
YU, CHIA-LIN
Executed: 2010-09-28
HUNG, JUI-PIN
Executed: 2010-09-28
HWANG, CHIEN LING
Executed: 2010-09-28
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-77, TAIWAN
Covered Property
(1)
Novel Semiconductor Package with Through Silicon Vias
Application:
14/608,306 →
Publication:
US 2015/0147834
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jan 29, 2015
From: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
To: TSMC SOLID STATE LIGHTING LTD.
Reel/Frame 034840/0253 →
Change of Name
Nov 25, 2015
From: TSMC SOLID STATE LIGHTING LTD.
To: CHIP STAR LTD.
Reel/Frame 037160/0220 →
Merger
Nov 25, 2015
From: CHIP STAR LTD.
To: EPISTAR CORPORATION
Reel/Frame 037160/0234 →