Patent Assignment
Reel/Frame 034840/0253
Assignment of Assignor's Interest
Recorded: 2015-01-29
Pages: 3
Assignor
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Executed: 2012-03-01
Assignee
TSMC SOLID STATE LIGHTING LTD.
9, LI-HSIN 4TH RD., HSINCHU SCIENCE PARK, HSINCHU, 300-77, TAIWAN
Covered Property
(1)
Novel Semiconductor Package with Through Silicon Vias
Application:
14/608,306 →
Publication:
US 2015/0147834
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jan 29, 2015
From: YU, CHEN-HUA; CHANG, HUNG-PIN; LIN, YUNG-CHI; YU, CHIA-LIN
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 034840/0149 →
Change of Name
Nov 25, 2015
From: TSMC SOLID STATE LIGHTING LTD.
To: CHIP STAR LTD.
Reel/Frame 037160/0220 →
Merger
Nov 25, 2015
From: CHIP STAR LTD.
To: EPISTAR CORPORATION
Reel/Frame 037160/0234 →