IP Library › Assignment 034850/0208
Patent Assignment
Reel/Frame 034850/0208

Assignment of Assignor's Interest

Recorded: 2015-01-30 Pages: 3
Assignors
CHENG, CHENG-WEI
Executed: 2015-01-29
SADANA, DEVENDRA K.
Executed: 2015-01-29
SHIU, KUEN-TING
Executed: 2015-01-29
Assignee
INTERNATIONAL BUSINESS MACHINES CORPORATION
NEW ORCHARD ROAD, ARMONK, NEW YORK, 10504
Covered Property (1)
Iii-V Cmos Integration on Silicon Substrate via Embedded Germanium-Containing Layer
Patent: 9,412,744 →
Application: 14/609,507 →
Publication: US 2016/0225768
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest May 11, 2020
From: INTERNATIONAL BUSINESS MACHINES CORPORATION
To: ELPIS TECHNOLOGIES INC.
Reel/Frame 052620/0961 →