Patent Assignment
Reel/Frame 034870/0920
Assignment of Assignor's Interest
Recorded: 2015-02-03
Pages: 4
Assignors
NAKAKO, HIDEO
Executed: 2014-12-19
TANAKA, TOSHIAKI
Executed: 2014-12-25
NATORI, MICHIKO
Executed: 2014-12-23
ISHIKAWA, DAI
Executed: 2014-12-22
MATSUMOTO, HIROSHI
Executed: 2014-12-19
Assignee
HITACHI CHEMICAL COMPANY, LTD.
9-2, MARUNOUCHI 1-CHOME,, CHIYODA-KU, TOKYO, 100-6606, JAPAN
Covered Property
(1)
Adhesive Composition and Semiconductor Device Using Same
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Mar 2, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062917/0865 →
Change of Name
Mar 3, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062946/0125 →
Change of Address
Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →