Patent Assignment
Reel/Frame 034881/0044
Assignment of Assignor's Interest
Recorded: 2015-02-03
Pages: 8
Assignors
CHOI, EUN-KYOUNG
Executed: 2014-04-28
JEONG, SEYOUNG
Executed: 2014-12-10
CHOI, KWANG-CHUL
Executed: 2014-04-28
MIN, TAE HONG
Executed: 2014-04-28
LEE, CHUNGSUN
Executed: 2014-05-14
KIM, JUNG-HWAN
Executed: 2014-04-28
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 443-742, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Packages and Methods of Fabricating the Same