IP Library Assignment 034897/0648
Patent Assignment
Reel/Frame 034897/0648

Assignment of Assignor's Interest

Recorded: 2015-02-05 Pages: 4
Assignor
YAMASAKI, KIMIYUKI
Executed: 2015-02-04
Assignee
SAMSUNG TECHWIN CO., LTD.
28 SUNGJU-DONG,, KYONGSANGNAM-DO, CHANGWON-CITY, 641-716, KOREA, REPUBLIC OF
Covered Property (1)
Carrier Tape Feeding Device, Chip Mounting System, and Chip Mounting Method
Application: 14/419,781 →
Publication: US 2015/0195964
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Jul 24, 2015
From: SAMSUNG TECHWIN CO., LTD.
To: HANWHA TECHWIN CO., LTD.
Reel/Frame 036254/0911 →
Change of Name Mar 1, 2019
From: HANWHA TECHWIN CO., LTD.
To: HANWHA AEROSPACE CO., LTD.
Reel/Frame 048478/0831 →
Assignment of Assignor's Interest Apr 10, 2019
From: HANWHA AEROSPACE CO., LTD.
To: HANWHA PRECISION MACHINERY CO., LTD.
Reel/Frame 048853/0048 →