Patent Assignment
Reel/Frame 034902/0990
Assignment of Assignor's Interest
Recorded: 2015-02-06
Pages: 3
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Wafer Structure and Method for Wafer Dicing