Patent Assignment
Reel/Frame 034915/0055
Assignment of Assignor's Interest
Recorded: 2015-02-09
Pages: 6
Assignors
HUR, JAE-YOUNG
Executed: 2014-06-16
KANG, HYUN-JOON
Executed: 2014-06-16
HONG, SUNG-MIN
Executed: 2014-06-16
Assignee
SAMSUNG ELECTRONICS CO., LTD
129 SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, 443-742, KOREA, REPUBLIC OF
Covered Property
(1)
System Interconnection of System-On-Chip