Patent Assignment
Reel/Frame 034923/0672
Assignment of Assignor's Interest
Recorded: 2015-02-10
Pages: 5
Assignee
GE EMBEDDED ELECTRONICS OY
KUORTANEENKATU 2, HELSINKI, 00510, FINLAND
Covered Property
(1)
Multi-Chip Package and Manufacturing Method
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.