Patent Assignment
Reel/Frame 051838/0444
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded: 2020-02-18
Received: 2020-02-18
Pages: 9
Assignor
GE EMBEDDED ELECTRONICS OY
Executed: 2020-01-13
Assignee
IMBERATEK, LLC
13921 PARK CENTER RD, SUITE 380, HERNDON, VA, 20171, UNITED STATES
Covered Applications
(26)
Electronic module
App. No. 16/104,979
→
Electronic module with EMI protection
App. No. 15/990,712
→
RIGID-FLEX MODULE AND MANUFACTURING METHOD
App. No. 15/407,273
→
Circuit board structure and method for manufacturing a circuit board structure
App. No. 15/355,096
→
RIGID-FLEX ELECTRONIC MODULE
App. No. 15/211,051
→
Circuit module and method of manufacturing the same
App. No. 15/084,530
→
Circuit module and method of manufacturing the same
App. No. 14/821,818
→
Manufacture of a circuit board and circuit board containing a component
App. No. 14/660,991
→
Electronic module with EMI protection
App. No. 14/622,954
→
METHOD FOR MANUFACTURING AN ELECTRONIC MODULE AND ELECTRONIC MODULE
App. No. 14/580,257
→
ELECTRONIC MODULE
App. No. 14/467,079
→
Electronic module with embedded jumper conductor
App. No. 14/285,710
→
CIRCUIT MODULE AND METHOD OF MANUFACTURING THE SAME
App. No. 14/231,758
→
MULTI-CHIP PACKAGE AND MANUFACTURING METHOD
App. No. 14/161,735
→
Method for Manufacturing a Circuit Board Structure
App. No. 14/076,292
→
METHOD FOR EMBEDDING A COMPONENT IN A BASE
App. No. 13/185,165
→
ELECTRONIC MODULE WITH FEED THROUGH CONDUCTOR BETWEEN WIRING PATTERNS
App. No. 12/842,056
→
ELECTRONICS MODULE COMPRISING AN EMBEDDED MICROCIRCUIT
App. No. 12/773,628
→
METHOD FOR MANUFACTURING AN ELECTRONIC MODULE
App. No. 12/753,329
→
CIRCUIT BOARD INCLUDING AN EMBEDDED COMPONENT
App. No. 12/702,653
→
ELECTRIC MODULE HAVING A CONDUCTIVE PATTERN LAYER
App. No. 12/699,628
→
ELECTRONIC MODULE WITH A CONDUCTIVE-PATTERN LAYER AND A METHOD OF MANUFACTURING SAME
App. No. 12/619,350
→
SINGLE-LAYER COMPONENT PACKAGE
App. No. 12/603,324
→
ELECTRONIC MODULE
App. No. 11/907,795
→
METHOD FOR EMBEDDING A COMPONENT IN A BASE
App. No. 11/878,557
→
METHOD FOR EMBEDDING A COMPONENT IN A BASE
App. No. 11/797,609
→