Method for manufacturing an electronic module and electronic module

1. An electronic module, comprising:

a first conductive pattern layer and a first insulating-material layer on at least one surface of the first conductive pattern layer,

at least one opening in the first insulating-material layer that extends through the first insulating-material layer,

a component having contact terminals, the component being arranged at least partially within the opening with its contact terminals electrically coupled to the first conductive pattern layer,

a second insulating-material layer provided on the first insulating-material layer, the component being embedded within the second insulating-material layer such that the second insulating-material layer surrounds the component on at least three sides

a second conductive pattern layer embedded between the first and second insulating-material layers, wherein the component extends through the second conductive pattern layer such that an upper surface of the component is higher than an upper surface of the second conductive pattern layer, and

a third conductive pattern layer on at least one surface of the second insulating-material layer.

2. The electronic module according to claim 1 , wherein the contact terminals include contact areas or contact protrusions.

3. The electronic module according to claim 1 , further comprising feed throughs provided in the first insulating-material layer electrically connecting the second conductive pattern layer and the first conductive pattern layer.

4. The electronic module according to claim 1 , wherein a distance between a second surface of the second conductive pattern layer and the first conductive pattern layer in a direction perpendicular to the surface of the first conductive pattern layer is not greater than a distance between a second surface of the component and the first conductive pattern layer.

5. The electronic module according to claim 1 , wherein a distance between a first surface of the second conductive pattern layer and the third conductive pattern layer in a direction perpendicular to the surface of the first conductive pattern layer is less than a distance between a first surface of the component and a second conductive pattern layer.

6. The electronic module according to claim 1 , wherein a height of the second conductive pattern layer is not greater than a height of the component.

7. The electronic module according to claim 1 , wherein the first and second insulating-material layers are of different insulating materials.

8. The electronic module according to claim 1 , wherein the component extends out of the opening in the first insulating-material layer and the second conductive pattern layer is located on the first insulating-material layer and embedded within the second insulating-material layer.

9. The electronic module according to claim 8 , wherein the component extends a distance out of the opening which is greater than the height of the second conductive pattern layer.

10. The electronic module according to claim 1 , wherein the component protrudes from the opening in the first insulating-material layer such that at least one surface of the component is not in contact or level with the first insulating-layer material.

11. The electronic module of claim 1 , wherein the component is between the first conductive pattern layer and third conductive pattern layer.

12. The electronic module of claim 1 , wherein the second conductive pattern layer is entirely embedded between the first and second insulating-material layers.

13. The electronic module of claim 1 , wherein the second conductive pattern layer and third conductive pattern layer are on opposing sides of the second insulating-material layer.

14. The electronic module of claim 1 , wherein the first conductive pattern layer and third conductive pattern layer are on opposing sides of the first insulating-material layer.