Circuit board structure and method for manufacturing a circuit board structure
The present publication discloses a method for manufacturing a circuit-board structure. In the method, a conductor layer is made, which comprises a conductor foil and a conductor pattern on the surface of the conductor foil. A component is attached to the conductor layer and the conductor layer is thinned, in such a way that the conductor material of the conductor layer is removed from outside the conductor pattern.
1. A circuit-board structure comprising:
a conductor foil on an insulating material layer;
a conductor pattern on top of the conductor foil; and
a component attached to the conductor foil and the conductor pattern;
wherein conductor material of the conductor foil is not present outside the conductor pattern, and
wherein the conductor foil is located between the conductor pattern and the insulating material layer, the insulating material layer not present between the conductor foil and the conductor pattern,
further comprising:
a recess formed in the conductor foil and the insulating material layer, wherein the component is embedded at least in part in the recess; and
contact openings in the insulating material layer at locations of contact areas of the component.
2. The circuit-board structure of claim 1 wherein the conductor pattern is on top of the conductor foil in openings of a conductor-pattern mask formed by a patterned insulating layer spread on the conductor foil.
3. The circuit-board structure of claim 2 , wherein the patterned insulating layer is a resist layer.
4. The circuit-board structure of claim 2 , wherein the patterned insulating layer is a photoresist layer.
5. The circuit-board structure of claim 1 further comprising a layer of a metal or metal alloy on a surface of the conductor pattern or on an interface between the conductor foil and the conductor pattern.
6. The circuit-board structure of claim 1 , wherein the contact openings are through the conductor pattern and the conductor foil.
7. The circuit-board structure of claim 1 , wherein the contact openings are through the conductor foil.
8. The circuit-board structure of claim 7 , wherein the contact openings are through the conductor pattern.
9. The circuit-board structure of claim 8 , wherein the contact openings in the conductor pattern correspond to the contact openings in the insulating material layer and the conductor foil.
10. The circuit-board structure of claim 1 further comprising adhesive which attaches the component to the conductor foil and the conductor pattern.
11. The circuit-board structure of claim 10 wherein the adhesive completely fills a space between the component and portions of the conductor foil and the conductor pattern not in contact with the component.
12. The circuit-board structure of claim 1 further comprising a filler material which fills the recess.
13. The circuit-board structure of claim 1 further comprising an insulator layer which surrounds the component and supports the conductor pattern.
14. The circuit-board structure of claim 13 , wherein the insulator layer which surrounds the component comprises a sheet of insulating material with an opening at a location of the component.
15. The circuit-board structure of claim 2 wherein the conductor pattern was grown on top of the conductor foil.
16. The circuit-board structure of claim 1 , wherein the component is located between the conductor pattern and a second conductor pattern.
17. A circuit-board structure comprising:
a conductor foil on an insulating material layer;
a conductor pattern on top of the conductor foil; and
a component attached to the conductor foil and the conductor pattern, the component embedded at least in part in adhesive;
a recess formed in the conductor foil and the insulating material layer; and
contact openings in the insulating material layer at locations of contact areas of the component,
wherein conductor material of the conductor foil is not present outside the conductor pattern and wherein the conductor foil is located between the conductor pattern and the insulating material layer.