Method for manufacturing a circuit board structure
View Patent ↗A method for manufacturing a circuit-board structure wherein a conductor foil is provided on an insulating material layer, a resist layer is spread on the conductor foil and a recess formed in the conductor foil and insulating material layer. The resist layer is patterned to form a conductor-pattern having openings wherein conductor patterns may be grown. A component is attached to the conductor foil and conductor pattern and conductor material is removed which does not form part of a conductor pattern.
1. A method for manufacturing a circuit-board structure, the method comprising:
providing a conductor foil on an insulating material layer;
spreading a resist layer on the conductor foil;
forming a recess in the conductor foil and insulating material layer after spreading the resist layer;
patterning the resist layer to form conductor-pattern masks having openings for conductor patterns;
growing a conductor pattern on top of the conductor foil in the openings of the conductor-pattern masks;
attaching a component to the conductor foil and conductor pattern; and
removing conductor material of the conductor foil from outside the conductor pattern.
2. The method according to claim 1 , wherein the resist layer is a photoresist layer.
3. The method according to claim 1 , further comprising;
adding a layer of a metal or metal alloy on a surface of the conductor pattern or on an interface between the conductor foil and the conductor pattern.
4. The method according to claim 1 , further comprising;
removing the resist layer after the growth of the conductor pattern.
5. The method according to claim 1 , further comprising;
forming contact openings in the conductor pattern.
6. The method according to claim 5 , wherein the contact openings are formed through the conductor pattern and the conductor foil.
7. The method according to claim 1 , further comprising;
forming contact openings in the insulating material layer and the conductor foil.
8. The method according to claim 7 , wherein the formation of the contact openings in the insulating material layer and the conductor foil does not form contact openings in the conductor pattern.
9. The method according to claim 8 , further comprising;
opening the contact openings in the conductor pattern corresponding to the formed contact openings in the insulating material layer and the conductor foil.
10. The method according to claim 1 , wherein the component is attached within the recess.
11. The method according to claim 10 , wherein the component is attached to the conductor foil and conductor pattern using an adhesive, said method further comprising the step of;
applying a sufficient amount of the adhesive to both attach the component to the circuit board structure and completely fill a space between the component and the structure coming against the component.
12. The method according to claim 1 , further comprising;
filling the recess with a filler material.
13. The method according to claim 1 , wherein the insulator layer which surrounds the component is formed by adding a sheet of insulating material with a premade opening at the location of the component.
14. A method for manufacturing a circuit-board structure, the method comprising:
providing a conductor foil;
spreading a resist layer on the conductor foil;
patterning the resist layer to form conductor-pattern masks having openings for conductor patterns;
forming contact openings through the conductor pattern and the conductor foil;
growing a conductor pattern on top of the conductor foil in the openings of the conductor-pattern masks;
attaching a component to the conductor foil and conductor pattern;
removing conductor material of the conductor foil from outside the conductor pattern.