Patent Assignment
Reel/Frame 054134/0172
Statement Regarding Security Interest Incorrectly Recorded Against Patents
Recorded: 2020-10-20
Pages: 5
Assignee
IMBERATEK, LLC
13921 PARK CENTER RD, SUITE 380, HERNDON, VIRGINIA, 20171
Covered Properties
(42)
Method for Embedding a Component in a Base
Method for Embedding a Component in a Base and Forming a Contact
Method for Manufacturing an Electronic Module
Method for Manufacturing an Electronic Module in an Installation Base
Method for Manufacturing an Electronics Module Comprising a Component Electrically Connected to a Conductor-Pattern Layer
Heat Conduction from an Embedded Component
Manufacture of a Layer Including a Component
Method for Manufacturing an Electronics Module
Electronics Module and Method for Manufacturing the Same
Method for Embedding a Component in a Base
Method for Embedding a Component in a Base
Electronic Module
Method for Manufacturing a Circuit Board
Method for Manufacturing a Circuit Board Structure, and a Circuit Board Structure
Method for Manufacturing a Circuit Board Structure
Manufacture of a Circuit Board Containing a Component
Method of Manufacturing a Wiring Board
Multi-Chip Package and Manufacturing Method
Circuit Board Structure Comprising an Electrical Component and a Method for Manufacturing a Circuit Board Structure Comprising an Electrical Component
Single-Layer Component Package
Electronic Module with a Conductive-Pattern Layer and a Method of Manufacturing Same
Electric Module Having a Conductive Pattern Layer
Circuit Board Including an Embedded Component
Method for Manufacturing an Electronic Module
Electronics Module Comprising an Embedded Microcircuit
Electronic Module with Vertical Connector Between Conductor Patterns
Electronic Module with Embedded Jumper Conductor
Electronic Module with Feed Through Conductor Between Wiring Patterns
Method for Controlling Warpage Within Electronic Products and an Electronic Product
Circuit Module and Method of Manufacturing the Same
Method for Manufacturing an Electronic Module and an Electronic Module
Method for Embedding a Component in a Base
Manufacturing Method and Electronic Module with New Routing Possibilities
Method for Manufacturing a Circuit Board Structure
Circuit Module and Method of Manufacturing the Same
Electronic Module
Method for Fabrication of an Electronic Module and Electronic Module
Electronic module with EMI protection
Method for Manufacturing an Electronic Module and an Electronic Module
Manufacture of a circuit board and circuit board containing a component
Circuit module and method of manufacturing the same
Circuit module and method of manufacturing the same
Related Assignments
(25)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Sep 23, 2004
From: TUOMINEN, RISTO
To: IMBERA ELECTRONICS OY
Reel/Frame 015815/0523 →
Assignment of Assignor's Interest
Sep 23, 2004
From: TUOMINEN, RISTO
To: IMBERA ELECTRONICS OY
Reel/Frame 015815/0606 →
Assignment of Assignor's Interest
Aug 25, 2005
From: TUOMINEN, RISTO; PALM, PETTERI
To: IMBERA ELECTRONICS OY
Reel/Frame 017665/0414 →
Assignment of Assignor's Interest
Nov 15, 2006
From: IIHOLA, ANTTI; JOKELA, TIMO
To: IMBERA ELECTRONICS OY
Reel/Frame 018518/0932 →
Assignment of Assignor's Interest
Feb 2, 2007
From: TUOMINEN, RISTO; PALM, PETTERI
To: IMBERA ELECTRONICS OY
Reel/Frame 018874/0136 →
Assignment of Assignor's Interest
Feb 9, 2007
From: TUOMINEN, RISTO; PALM, PETTERI
To: IMBERA ELECTRONICS OY
Reel/Frame 018876/0782 →
Assignment of Assignor's Interest
Feb 12, 2007
From: IIHOLA, ANTTI; JOKELA, TIMO; PALM, PETTERI; TUOMINEN, RISTO
To: IMBERA ELECTRONICS OY
Reel/Frame 018881/0893 →
Assignment of Assignor's Interest
May 9, 2007
From: TUOMINEN, RISTO; IIHOLA, ANTTI
To: IMBERA ELECTRONICS OY
Reel/Frame 019336/0177 →
Assignment of Assignor's Interest
Sep 28, 2007
From: TUOMINEN, RISTO; IIHOLA, ANTTI
To: IMBERA ELECTRONICS OY
Reel/Frame 019893/0412 →
Assignment of Assignor's Interest
Jun 30, 2008
From: TUOMINEN, RISTO; PALM, PETTERI; IIHOLA, ANTTI
To: IMBERA ELECTRONICS OY
Reel/Frame 021168/0464 →
Assignment of Assignor's Interest
Jun 30, 2008
From: IIHOLA, ANTTI; JOKELA, TIMO; PALM, PETTERI; TUOMINEN, RISTO
To: IMBERA ELECTRONICS OY
Reel/Frame 021169/0031 →
Assignment of Assignor's Interest
Jul 24, 2008
From: TUOMINEN, RISTO; IIHOLA, ANTTI; PALM, PETTERI
To: IMBERA ELECTRONICS OY
Reel/Frame 021287/0032 →
Assignment of Assignor's Interest
Sep 11, 2008
From: TUOMINEN, RISTO; IIHOLA, ANTTI; PALM, PETTERI
To: IMBERA ELECTRONICS OY
Reel/Frame 021514/0686 →
Assignment of Assignor's Interest
Nov 12, 2008
From: TUOMINEN, RISTO; PALM, PETTERI; IIHOLA, ANTTI
To: IMBERA ELECTRONICS OY
Reel/Frame 021823/0131 →
Assignment of Assignor's Interest
May 27, 2009
From: PALM, PETTERI; KUJALA, ARNI
To: IMBERA ELECTRONICS OY
Reel/Frame 022739/0073 →
Assignment of Assignor's Interest
Jan 31, 2012
From: IMBERA ELECTRONICS OY
To: EPCOS AG
Reel/Frame 027627/0428 →
Change of Name
Nov 14, 2013
From: IMBERA ELECTRONICS OY
To: GE EMBEDDED ELECTRONICS OY
Reel/Frame 031635/0968 →
Assignment of Assignor's Interest
Dec 9, 2014
From: EPCOS AG
To: GE EMBEDDED ELECTRONICS OY
Reel/Frame 034540/0256 →
Assignment of Assignor's Interest
Jan 22, 2020
From: TUOMINEN, RISTO; PALM, PETTERI
To: GE EMBEDDED ELECTRONICS OY
Reel/Frame 051576/0643 →
Change of Name
Jan 23, 2020
From: IMBERA ELECTRONICS OY
To: GE EMBEDDED ELECTRONICS OY
Reel/Frame 051669/0086 →
Assignment of Assignor's Interest
Feb 5, 2020
From: GE EMBEDDED ELECTRONICS OY
To: IMBERATEK, LLC
Reel/Frame 051730/0868 →
Assignment of Assignor's Interest
Feb 18, 2020
From: GE EMBEDDED ELECTRONICS OY
To: IMBERATEK, LLC
Reel/Frame 051838/0444 →
Patent Security Agreement
Jun 5, 2020
From: ACACIA RESEARCH GROUP LLC; AMERICAN VEHICULAR SCIENCES LLC; BONUTTI SKELETAL INNOVATIONS LLC; CELLULAR COMMUNICATIONS EQUIPMENT LLC
To: STARBOARD VALUE INTERMEDIATE FUND LP, AS COLLATERAL AGENT
Reel/Frame 052853/0153 →
Release of Security Interest in Patents
Jul 8, 2020
From: STARBOARD VALUE INTERMEDIATE FUND LP
To: ACACIA RESEARCH GROUP LLC; AMERICAN VEHICULAR SCIENCES LLC; BONUTTI SKELETAL INNOVATIONS LLC; CELLULAR COMMUNICATIONS EQUIPMENT LLC
Reel/Frame 053654/0254 →
Corrective Assignment to Correct the Assignee Name Previously Recorded on Reel 053654 Frame 0254. Assignor(S) Hereby Confirms the Release of Security Interest Granted Pursuant to the Patent Security Agreement Previously Recorded.
Dec 30, 2020
From: STARBOARD VALUE INTERMEDIATE FUND LP
To: R2 SOLUTIONS LLC
Reel/Frame 054981/0377 →