Method for manufacturing an electronics module
View Patent ↗Method for manufacturing an electronic module, which electronic module includes a component ( 6 ), which has contact areas ( 17 ), which are connected electrically to a conductor-pattern layer ( 14 ). The manufacture according to the method starts from a layered membrane, which comprises at least a conductor layer ( 4 ) and an insulator layer ( 10 ) on the first surface of the conductor layer ( 4 ). Contact openings ( 17 ), the mutual positions of which correspond to the mutual positions of the contact areas ( 7 ) of the component ( 6 ), and which penetrate both the conductor layer ( 4 ) and the insulator layer ( 10 ), are made in the membrane. After the manufacture of the contact openings ( 17 ), the component ( 6 ) is attached to the surface of the insulator layer ( 10 ), in such a way that the contact areas ( 7 ) of the component ( 6 ) line up next to the contact openings ( 17 ). After this, at least in the contact openings ( 17 ) and the contact areas ( 7 ) of the component ( 6 ) a conductor material is made, which connects the component ( 6 ) to the conductor layer ( 4 ) and the conductor layer ( 4 ) is patterned to form a conductor-pattern layer ( 14 ).
1. Method for manufacturing an electronic module, which electronic module includes a component, which has at least one contact area, which is connected electrically to a conductor-pattern layer, the method comprising:
taking a layered membrane, which comprises at least a conductor layer and an insulator layer on the first surface of the conductor layer,
making contact openings in the conductor layer, the mutual positions of which correspond to the mutual positions of the contact areas of each component to be connected and which penetrate both the conductor layer and the insulator layer,
after the manufacture of the contact openings, attaching each component to the surface of the insulator layer of the layered membrane, positioned such that the contact areas of the component become aligned on the corresponding contact openings,
making, at least in the contact openings and the contact areas of the component, a conductor material that connects the component to the conductor layer, and
patterning the conductor layer to form the conductor-pattern layer after making the conductor material which connects the component to the conductor layer,
wherein the making of the conductor material comprises first growing a thin layer of metal using a chemical growing method and then continuing the growth using an electrochemical growing method.
2. Method according to claim 1 , wherein, before the contact openings are made, the layered membrane consists of a conductor layer and an insulator layer on the first surface of the conductor layer.
3. Method according to claim 1 , wherein, before the contact openings are made, the layered membrane comprises a support layer on the second surface of the conductor layer.
4. Method according to claim 1 , wherein, before the contact openings are made, the conductor layer of the layered membrane contains essentially all the conductor material, from which the conductor-pattern layer is later created.
5. Method according to claim 1 , wherein the insulator layer of the layered membrane is of epoxy.
6. Method according to claim 1 , wherein the thickness of the insulator layer of the layered membrane is less than 10 micrometres.
7. Method according to claim 1 , wherein the component is attached to the insulator layer by an insulating adhesive.
8. Method according to claim 1 , further comprising manufacturing a second conductor-pattern layer in the electronic module.
9. Method according to claim 1 , wherein more than one component is placed in the electronic module and the embedded components are connected electrically to each other in order to create an operational totality.
10. Method according to claim 1 , wherein at least one component to be attached to the conductor layer is an unpacked microcircuit chip.
11. Method for manufacturing an electronic module, which electronic module includes a component, which has a plurality of contact areas electrically connected to a conductor-pattern layer, the method comprising:
providing a layered membrane comprising a conductor layer and an insulator layer containing epoxy, the conductor layer having a first surface and a second surface and the insulator layer being located on the first surface of the conductor layer, the conductor layer further including contact openings located according to the mutual positions of the contact areas;
positioning the component such that the contact areas of the component become aligned on the respective contact openings;
attaching the component to the surface of the insulator layer of the layered membrane by means of an insulating adhesive containing epoxy;
cleaning the contact openings to expose the contact areas;
chemically depositing a first layer of copper in the contact openings and the contact areas of the component as well as on the second surface of the conductor layer, the first layer of copper electrically connecting the contact areas of the component to the conductor layer;
electrochemically plating a second layer of copper on said first layer of copper; and
patterning the conductor layer to form the conductor-pattern layer after making the first layer of copper electrically connecting the contact areas of the component to the conductor layer.