IP Library Assignment 051730/0868
Patent Assignment
Reel/Frame 051730/0868

Assignment of Assignor's Interest

Recorded: 2020-02-05 Pages: 9
Assignor
GE EMBEDDED ELECTRONICS OY
Executed: 2020-01-13
Assignee
IMBERATEK, LLC
13921 PARK CENTER RD, SUITE 380, HERNDON, VIRGINIA, 20171
Covered Properties (26)
Method for Embedding a Component in a Base
Patent: 7,294,529 →
Application: 10/502,336 →
Publication: US 2005/0224988
Method for Embedding a Component in a Base and Forming a Contact
Patent: 6,991,966 →
Application: 10/502,340 →
Publication: US 2005/0124148
Method for Manufacturing an Electronic Module
Patent: 7,299,546 →
Application: 10/546,820 →
Publication: US 2006/0218782
Method for Manufacturing an Electronic Module in an Installation Base
Patent: 7,696,005 →
Application: 10/572,340 →
Publication: US 2007/0166886
Method for Manufacturing an Electronics Module Comprising a Component Electrically Connected to a Conductor-Pattern Layer
Patent: 8,240,032 →
Application: 11/570,673 →
Publication: US 2008/0261338
Heat Conduction from an Embedded Component
Patent: 8,076,586 →
Application: 11/587,694 →
Publication: US 2007/0227761
Manufacture of a Layer Including a Component
Patent: 7,673,387 →
Application: 11/659,190 →
Publication: US 2008/0295326
Method for Manufacturing an Electronics Module
Patent: 8,062,537 →
Application: 11/667,429 →
Publication: US 2007/0267136
Electronics Module and Method for Manufacturing the Same
Patent: 8,547,701 →
Application: 11/791,547 →
Publication: US 2008/0094805
Method for Manufacturing a Circuit Board
Patent: 8,240,033 →
Application: 11/917,711 →
Publication: US 2008/0196930
Method for Manufacturing a Circuit Board Structure, and a Circuit Board Structure
Patent: 8,225,499 →
Application: 11/917,724 →
Publication: US 2009/0014872
Method for Manufacturing a Circuit Board Structure
Patent: 8,581,109 →
Application: 11/917,737 →
Publication: US 2008/0202801
Manufacture of a Circuit Board Containing a Component
Patent: 8,984,746 →
Application: 12/293,412 →
Publication: US 2009/0133251
Method of Manufacturing a Wiring Board
Patent: 8,286,341 →
Application: 12/420,617 →
Publication: US 2009/0260866
Multi-Chip Package and Manufacturing Method
Patent: 8,659,134 →
Application: 12/506,519 →
Publication: US 2010/0052129
Circuit Board Structure Comprising an Electrical Component and a Method for Manufacturing a Circuit Board Structure Comprising an Electrical Component
Patent: 8,631,566 →
Application: 12/546,454 →
Publication: US 2010/0046186
Rigid-Flex Module and Manufacturing Method
Patent: 9,425,158 →
Application: 12/652,399 →
Publication: US 2010/0170703
Electronic Module with Emi Protection
Patent: 8,964,409 →
Application: 12/700,812 →
Publication: US 2010/0202127
Electronic Module with Vertical Connector Between Conductor Patterns
Patent: 8,238,113 →
Application: 12/842,052 →
Publication: US 2012/0020044
Electronic Module with Embedded Jumper Conductor
Patent: 8,735,735 →
Application: 12/842,055 →
Publication: US 2012/0018203
Method for Controlling Warpage Within Electronic Products and an Electronic Product
Patent: 9,420,694 →
Application: 12/872,538 →
Publication: US 2012/0048605
Circuit Module and Method of Manufacturing the Same
Patent: 8,699,233 →
Application: 12/990,785 →
Publication: US 2011/0061909
Method for Manufacturing an Electronic Module and an Electronic Module
Patent: 8,704,359 →
Application: 13/118,650 →
Publication: US 2011/0291293
Manufacturing Method and Electronic Module with New Routing Possibilities
Patent: 9,301,394 →
Application: 13/698,670 →
Publication: US 2013/0175075
Method for Fabrication of an Electronic Module and Electronic Module
Patent: 9,999,136 →
Application: 14/569,900 →
Publication: US 2016/0174387
Method for Manufacturing an Electronic Module and an Electronic Module
Patent: 9,363,898 →
Application: 14/623,569 →
Publication: US 2015/0163920
Related Assignments (25)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Sep 23, 2004
From: TUOMINEN, RISTO
To: IMBERA ELECTRONICS OY
Reel/Frame 015815/0606 →
Assignment of Assignor's Interest Sep 23, 2004
From: TUOMINEN, RISTO
To: IMBERA ELECTRONICS OY
Reel/Frame 015815/0523 →
Assignment of Assignor's Interest Aug 25, 2005
From: TUOMINEN, RISTO; PALM, PETTERI
To: IMBERA ELECTRONICS OY
Reel/Frame 017665/0414 →
Assignment of Assignor's Interest Nov 15, 2006
From: IIHOLA, ANTTI; JOKELA, TIMO
To: IMBERA ELECTRONICS OY
Reel/Frame 018518/0932 →
Assignment of Assignor's Interest Feb 2, 2007
From: TUOMINEN, RISTO; PALM, PETTERI
To: IMBERA ELECTRONICS OY
Reel/Frame 018874/0136 →
Assignment of Assignor's Interest Feb 9, 2007
From: TUOMINEN, RISTO; PALM, PETTERI
To: IMBERA ELECTRONICS OY
Reel/Frame 018876/0782 →
Assignment of Assignor's Interest Feb 12, 2007
From: IIHOLA, ANTTI; JOKELA, TIMO; PALM, PETTERI; TUOMINEN, RISTO
To: IMBERA ELECTRONICS OY
Reel/Frame 018881/0893 →
Assignment of Assignor's Interest May 9, 2007
From: TUOMINEN, RISTO; IIHOLA, ANTTI
To: IMBERA ELECTRONICS OY
Reel/Frame 019336/0177 →
Assignment of Assignor's Interest Sep 28, 2007
From: TUOMINEN, RISTO; IIHOLA, ANTTI
To: IMBERA ELECTRONICS OY
Reel/Frame 019893/0412 →
Assignment of Assignor's Interest Jun 30, 2008
From: TUOMINEN, RISTO; PALM, PETTERI; IIHOLA, ANTTI
To: IMBERA ELECTRONICS OY
Reel/Frame 021168/0464 →
Assignment of Assignor's Interest Jun 30, 2008
From: IIHOLA, ANTTI; JOKELA, TIMO; PALM, PETTERI; TUOMINEN, RISTO
To: IMBERA ELECTRONICS OY
Reel/Frame 021169/0031 →
Assignment of Assignor's Interest Jul 24, 2008
From: TUOMINEN, RISTO; IIHOLA, ANTTI; PALM, PETTERI
To: IMBERA ELECTRONICS OY
Reel/Frame 021287/0032 →
Assignment of Assignor's Interest Sep 11, 2008
From: TUOMINEN, RISTO; IIHOLA, ANTTI; PALM, PETTERI
To: IMBERA ELECTRONICS OY
Reel/Frame 021514/0686 →
Assignment of Assignor's Interest Nov 12, 2008
From: TUOMINEN, RISTO; PALM, PETTERI; IIHOLA, ANTTI
To: IMBERA ELECTRONICS OY
Reel/Frame 021823/0131 →
Assignment of Assignor's Interest May 27, 2009
From: PALM, PETTERI; KUJALA, ARNI
To: IMBERA ELECTRONICS OY
Reel/Frame 022739/0073 →
Assignment of Assignor's Interest Jul 22, 2009
From: IIHOLA, ANTTI; TUOMINEN, RISTO
To: IMBERA ELECTRONICS OY
Reel/Frame 022991/0890 →
Assignment of Assignor's Interest Nov 9, 2009
From: PALM, PETTERI; WARIS, TUOMAS
To: IMBERA ELECTRONICS OY
Reel/Frame 023492/0121 →
Assignment of Assignor's Interest Feb 19, 2010
From: IIHOLA, ANTTI; WARIS, TUOMAS
To: IMBERA ELECTRONICS OY
Reel/Frame 023964/0892 →
Assignment of Assignor's Interest Jan 31, 2012
From: IMBERA ELECTRONICS OY
To: EPCOS AG
Reel/Frame 027627/0428 →
Change of Name Nov 14, 2013
From: IMBERA ELECTRONICS OY
To: GE EMBEDDED ELECTRONICS OY
Reel/Frame 031635/0968 →
Change of Name Jan 15, 2014
From: IMBERA ELECTRONICS OY
To: GE EMBEDDED ELECTRONICS OY
Reel/Frame 032019/0225 →
Assignment of Assignor's Interest Dec 9, 2014
From: EPCOS AG
To: GE EMBEDDED ELECTRONICS OY
Reel/Frame 034540/0256 →
Change of Name Jan 23, 2020
From: IMBERA ELECTRONICS OY
To: GE EMBEDDED ELECTRONICS OY
Reel/Frame 051669/0086 →
Patent Security Agreement Jun 5, 2020
From: ACACIA RESEARCH GROUP LLC; AMERICAN VEHICULAR SCIENCES LLC; BONUTTI SKELETAL INNOVATIONS LLC; CELLULAR COMMUNICATIONS EQUIPMENT LLC
To: STARBOARD VALUE INTERMEDIATE FUND LP, AS COLLATERAL AGENT
Reel/Frame 052853/0153 →
Release of Security Interest in Patents Jul 8, 2020
From: STARBOARD VALUE INTERMEDIATE FUND LP
To: ACACIA RESEARCH GROUP LLC; AMERICAN VEHICULAR SCIENCES LLC; BONUTTI SKELETAL INNOVATIONS LLC; CELLULAR COMMUNICATIONS EQUIPMENT LLC
Reel/Frame 053654/0254 →