Method of manufacturing a wiring board
View Patent ↗A method for manufacturing a wiring board, comprising the steps of mounting at least one structural aid on each side of a planar temporary bonding means, arranging a slot from the at least one structural aid on each side of the planar temporary bonding means, embedding the electrical component in the slot, such that the terminals of the electrical component face away from the planar temporary bonding means, mounting at least one electrical component on a component foil, such that the terminals of the electrical component face the component foil, mounting the component foil at least partially on the at least one structural aid, on each side of the planar temporary bonding means.
1. A method for manufacturing a wiring board, wherein the method comprises the steps of
mounting at least one structural aid on each side of a planar temporarily used bonding means,
creating a slot for an electrical component from the at least one structural aid on each side of the planar temporarily used bonding means,
embedding the electrical component in the slot, such that the terminals of the electrical component are located on the side farthest from the planar temporarily used bonding means,
mounting at least one electrical component on a foil, such that the terminals of the electrical component are in contact with the foil,
mounting the component foil at least partially on the at least one structural aid, on each side of the planar temporarily used bonding means, and
separating the at least one structural aids on each side of the planar temporarily used bonding means from each other.
2. The method of claim 1 , wherein the structural aid is a molding resin sheet, for embedding the electrical component into the slot in the molding resin sheet.
3. The method of claim 1 , wherein the planar temporarily used bonding means is a foil.
4. The method of claim 1 , wherein the method comprises a step of
mounting a structural layer on each side of the planar temporarily used bonding means in between the at least one structural aid and the planar temporarily used bonding means.
5. The method of claim 4 , wherein the surface area of the planar temporarily used bonding means is smaller than the surface area of the structural layer mounted on each side of the planar temporarily used bonding means, such that the structural layers on each side of the planar temporarily used bonding means are in direct contact with each other at a peripheral portion of the structural layers.
6. The method of claim 4 , wherein the method comprises a step of
bonding the structural layers on each side of the planar temporarily used bonding means together at a peripheral portion of the structural layers.
7. The method of claim 1 , wherein the structural layers and/or the at least one structural aid are polymer or polymeric composite.
8. The method of claims 1 , wherein the method comprises a step of
at least partly encapsulating the at least one electrical component in filling material by heat-treating the structural layer and/or the at least one structural aid in which the at least one electrical component is embedded.