Method for controlling warpage within electronic products and an electronic product
The present invention discloses a method for minimizing warpage in the electronic products, and the structures of such electronic products as well. Groove holes are formed into the insulating material layer or several layers. The groove holes can be processed by laser drilling or by other suitable means. A cured epoxy adhesive will fill the groove holes after the heat and pressure treatment performed to the circuit structure. The electronic product may contain several insulating layers and embedded electronic components connected to a wiring layer. A double-stacked symmetrical structure can also be manufactured. Asymmetrical structures with different sized embedded components can be handled as well. The groove holes can be shaped as straight short lines, ellipses, crosses, circles etc, or as any combination of different shapes. The groove holes can be scratched so that they locate outside strips, between the strips of a panel, between blocks of the strip, between modules of the block or between embedded components of the module.
1. A method of manufacturing an electronic product with decreased warpage, the method comprising:
manufacturing at least one wiring pattern layer;
manufacturing at least one insulating material layer;
forming groove holes to the at least one insulating material layer;
connecting at least one embedded component to the at least one wiring pattern layer;
stacking the at least one wiring pattern layer having the at least one embedded component and the at least one insulating material layer having the groove holes on top of each other to form a stacked substrate such that the insulating material layer and the embedded component are on the same side of the wiring pattern layer;
curing the stacked substrate together with heat and pressure treatment in order to achieve the electronic product with decreased warpage,
wherein the groove holes are formed to the at least one insulating material layer prior to curing of the stacked substrate; and
wherein the groove holes are configured to cut the longitudinal forces caused by reinforcing fibers within the insulating material layer.
2. The method according to claim 1 , further comprising:
forming the groove holes by laser drilling means.
3. The method according to claim 1 , further comprising:
forming the groove holes by mechanical means, cutting means, boring means, chemical reacting means or etching means.
4. The method according to claim 1 , further comprising:
placing the embedded component in an installation cavity formed in at least one insulating material layer.
5. The method according to claim 1 , wherein the groove holes are shaped as longitudinal ellipses, transversal ellipses, circles, crosses, rotated crosses, lines, triangles, squares, polygons or as a combination of at least two of the shapes.
6. The method according to claim 1 , further comprising:
forming the groove holes outside strips and/or between strips of a panel and/or between blocks of a strip and/or between modules of a block and/or between embedded components of a module.
7. The method according to claim 1 , wherein a width of the groove holes is between 50 and 300 micrometers.
8. The method according to claim 1 , wherein a thickness of the insulating material layers is between 40 and 240 micrometers.
9. The method according to claim 1 wherein, prior to curing the stacked substrate, the groove holes are filled with an adhesive material.
10. The method according to claim 1 wherein the component is a semiconductor component.