Method for manufacturing an electronics module comprising a component electrically connected to a conductor-pattern layer
View Patent ↗Method for manufacturing an electronic module, which electronic module includes a component ( 6 ), which is connected electrically to a conductor-pattern layer ( 14 ). In the method contact openings ( 17 ) are made in the conductor layer ( 4 ), the mutual positions of which correspond to the mutual positions of the contact areas ( 7 ) of the component ( 6 ). After this, the component ( 6 ) and the conductor layer ( 4 ) are aligned relative to each other, in such a way that the contact areas ( 7 ) of the component ( 6 ) come to the positions of the contact openings ( 17 ), and the component ( 6 ) is secured. After this, at least in the contact openings ( 17 ) and the contact areas ( 7 ) of the component ( 6 ) a conductor material is made that connects the component ( 6 ) to the conductor layer ( 4 ). After the making of the contact the conductor layer ( 4 ) is patterned to form a conductor-pattern layer ( 14 ).
1. Method for manufacturing an electronic module having a component which has contact areas connected electrically to a conductor-pattern layer, the method comprising the steps of:
making contact openings in a conductor layer within a connection area, the positions of the contact openings corresponding to the positions of the contact areas of the component,
forming an adhesive layer within the connection area;
aligning the component and the conductor layer relative to each other, in such a way that the contact areas of the component come to the positions of the contact openings,
securing the component to the conductor layer with the adhesive layer, the adhesive layer being in direct contact with the component and the conductor layer,
forming conductor material in at least the contact openings and at the contact areas of the component, wherein the conductor material electrically connects the component to the conductor layer, and
patterning the conductor layer to form the conductor-pattern layer.
2. Method according to claim 1 , wherein the contact openings are made in the unpatterned conductor layer.
3. Method according to claim 2 , wherein when making the contact openings there is a support layer on a second surface of the conductor layer.
4. Method according to claim 3 , wherein the contact openings are made from the direction of a first surface through the conductor layer, in such a way that the contact openings extend to the support layer, and before the components are connected to the conductor layer the contact openings are revealed by removing or thinning the support layer.
5. Method according to claim 1 , wherein the adhesive layer comprises an insulating adhesive.
6. Method according to claim 5 , wherein after the securing of the component, and before the forming of the conductor material at the contact areas of the component:
the contact openings and the contact areas of the component are cleaned through the contact openings.
7. Method according to claim 1 , wherein the conductor material connecting the component to the conductor layer is made using a chemical and/or an electrochemical metallization method.
8. Method according to claim 1 , wherein the conductor layer is included in a board, which has a first and a second surface, and which board includes an insulating-material layer between the first and the second surfaces, as well as the conductor layer on at least the first surface, and that in the method:
at least one recess for the component is made in the board and extends through the second surface and the insulating-material layer to the conductor layer on the first surface, which covers the recess from the direction of the first surface,
in which case the contact openings are made in the conductor layer at the bottom of the recess.
9. Method according to claim 8 , in which the component is one of a plurality of components which are placed in the insulating-material layer facing towards both the first and the second surface and electrical contacts are formed to the components in such a way that at least some of the components are connected to the conductor layer on the first surface and at least another of the components is connected to the conductor layer on the second surface.
10. Method according to claim 1 , wherein a first surface of the conductor layer, against which the component is attached, is a bare surface and after the securing of the component:
an insulating-material layer, which surrounds the component, is made on the first surface of the conductor layer.
11. Method according to claim 10 , wherein a second conductor layer is made on the insulating-material layer such that the insulating-material layer is between the first conductor layer and the second conductor layer.
12. Method according to claim 1 , wherein more than one component is embedded in the electronic module and the embedded components are connected electrically to each other in order to create an operational totality.
13. Method according to claim 1 , in which the component is an unpackaged microcircuit chip.
14. Method according to claim 1 , wherein when making the contact openings there is a support layer on a second surface of the conductor layer.
15. Method according to claim 5 , wherein the conductor material connecting the component to the conductor layer is made using a chemical and/or an electrochemical metallization method.
16. Method according to claim 5 , wherein the conductor layer is included in a board, which has a first and a second surface, and which board includes an insulating-material layer between the first and the second surfaces, as well as the conductor layer on at least the first surface, and that in the method:
at least one recess for the component is made in the board and extends through the second surface and the insulating-material layer to the conductor layer on the first surface, which covers the recess from the direction of the first surface,
in which case the contact openings are made in the conductor layer at the bottom of the recess.
17. Method according to claim 5 , wherein a first surface of the conductor layer, against which the component is attached, is a bare surface and after the securing of the component:
an insulating-material layer, which surrounds the component, is made on the first surface of the conductor layer.
18. Method according to claim 3 , wherein the adhesive layer comprises an insulating adhesive.
19. Method according to claim 3 , wherein a first surface of the conductor layer, against which the component is attached, is a bare surface and after the securing of the component:
an insulating-material layer, which surrounds the component, is made on the first surface of the conductor layer.
20. Method according to claim 3 , wherein more than one component is embedded in the electronic module and the embedded components are connected electrically to each other in order to create an operational totality.