Method for manufacturing an electronic module and an electronic module
View Patent ↗This publication discloses an electronic module and a method for manufacturing an electronic module, in which a component ( 6 ) is glued ( 5 ) to the surface of a conductive layer, from which conductive layer conductive patterns ( 14 ) are later formed. After gluing the component ( 6 ), an insulating-material layer ( 1 ), which surrounds the component ( 6 ) attached to the conductive layer, is formed on, or attached to the surface of the conductive layer. After the gluing of the component ( 6 ), feed-throughs are also made, through which electrical contacts can be made between the conductive layer and the contact zones ( 7 ) of the component. After this, conductive patterns ( 14 ) are made from the conductive layer, to the surface of which the component ( 6 ) is glued.
1. An electronic module, the module comprising:
an insulating layer having a first surface and a second surface, said insulating layer comprising at least one core sheet having at least one hole;
a first conductive-pattern layer arranged on the first surface of the insulating layer;
at least one bonding layer between the at least one core sheet and the first conductive-pattern layer, said at least one bonding layer forming part of the insulating layer;
at least one component within the insulating layer, said component having contact zones arranged towards the first conductive layer and wherein at least a portion of the component is located within the at least one hole;
a hardened adhesive layer between the component and the first conductive-pattern layer, said hardened adhesive layer forming part of the insulating layer; and
a plurality of feedthroughs penetrating the hardened adhesive layer and forming electrical contacts between the first conductive-pattern layer and the contact zones of the component.
2. The electronic module of claim 1 , wherein at least one of the at least one core sheet or the at least one component is centered between the first surface and the second surface.
3. The electronic module of claim 1 , wherein at least one of the at least one core sheet or the at least one component is placed in a non-centered position between the first surface and the second surface.
4. The electronic module according to claim 1 , wherein the insulating layer further comprises filler material at least in said hole.
5. The electronic module according to of claim 4 , wherein the at least one core sheet has a first coefficient of thermal expansion, the at least one component has a second coefficient of thermal expansion lower than the first coefficient of thermal expansion and the filler material has a third coefficient of thermal expansion higher than the first coefficient of thermal expansion.
6. The electronic module of claim 5 , wherein the third coefficient of thermal expansion is at least two times higher than the first coefficient of thermal expansion.
7. The electronic module of claim 5 , wherein the first coefficient of thermal expansion is between 8 and 30, the second coefficient of thermal expansion is between 3 and 15, and the third coefficient of thermal expansion is between 50 and 150.
8. The electronic module according to claim 1 , further comprising a second conductive-pattern layer arranged on the second surface of the insulating layer and at least one bonding layer between the at least one core sheet and the second conductive-pattern layer.
9. The electronic module of claim 8 , wherein filler material is present between the component and the second conductive-pattern layer.
10. The electronic module of claim 9 , wherein filler material is present between the at least one core sheet and the second conductive-pattern layer.
11. The electronic module according to claim 1 , wherein the insulating layer further comprises an additional insulation layer, which is present between the hardened adhesive layer and the first conductive-pattern layer as well as between the at least one core sheet and the first conductive-pattern layer.
12. The electronic module according to claim 1 , further comprising
a second insulating layer arranged over the first conductive-pattern layer on the first surface of the insulating layer; and
a third conductive-pattern layer arranged on the second insulating layer.
13. The electronic module according to claim 1 , wherein the electronic module has an operating temperature range and wherein the insulating layer further comprises:
a first amount of insulating material between the core sheet and the first surface, said first amount of insulating material having sufficient first properties such that it is capable of inducing a first strain due to thermal expansion and shrinkage;
a second amount of insulating material between the core sheet and the second surface, said second amount of insulating material having sufficient second properties such that it is capable of inducing a second strain due to thermal expansion and shrinkage substantially equal to the first strain at least within the operating temperature range.
14. The electronic module according to claim 1 , wherein:
the insulating layer has third properties within the area wherein the insulating layer comprises said at least one core sheet, said third properties being capable of inducing a third strain due to at least thermal expansion and shrinkage;
the component has fourth properties capable of inducing a fourth strain due to at least thermal expansion;
the insulating layer comprises a volume of filler material having fifth properties capable of inducing a fifth strain due to at least thermal expansion and shrinkage;
wherein the third strain, fourth strain and fifth strain substantially compensate each other.
15. The electronic module according to claim 1 , wherein the at least one core sheet is a rigid sheet of substantially cured epoxy with glass-fibre reinforcement.
16. The electronic module according to claim 1 , wherein the at least one bonding layer has at least one hole such that said at least one bonding layer is not present between the component and the first conductive-pattern layer.
17. The electronic module according to claim 1 , wherein
the at least one component is capable of inducing a fourth strain due to at least thermal expansion;
the insulating layer comprises materials and interfaces between the materials as well as an interface with the at least one component, said materials and interfaces capable of inducing a sixth strain due to at least thermal expansions and shrinkages of the materials; and
the at least one component is placed in one of a centered position or a non-centered position between the first surface and the second surface such that the fourth strain is capable of at least partially compensating the effect of the sixth strain.
18. An electronic module, the module comprising:
an insulating layer having a first surface and a second surface, said insulating layer comprising at least one core sheet, said at least one core sheet containing at least one glass-fibre mat and having at least one hole in said at least one glass-fibre mat;
at least one component within the insulating layer, said component having contact zones arranged towards the first surface and wherein at least a portion of the component is located within said at least one hole;
a first conductive-pattern layer arranged on the first surface of the insulating layer;
attachment areas between each of said at least one component and said first conductive-pattern layer;
a hardened adhesive layer substantially within the attachment areas, said hardened adhesive layer forming part of the insulating layer; and
a plurality of feedthroughs penetrating the hardened adhesive layer and forming electrical contacts between the first conductive-pattern layer and at least a plurality of the contact zones of said at least one component.
19. The electronic module of claim 18 , wherein
the first surface has a first surface area;
the hardened adhesive layer has a second surface area substantially parallel with the first surface, said second surface area being smaller than the first surface area; and
the at least one component has a third surface area substantially parallel with the first surface said third surface area being smaller than the second surface area.
20. The electronic module of claim 18 , comprising at least one bonding layer between the at least one core sheet and the first conductive-pattern layer outside the attachment areas, said at least one bonding layer forming part of the insulating layer.
21. The electronic module of claim 20 , wherein the at least one bonding layer has a fourth surface area substantially parallel with the first surface such that the sum of said fourth surface area and said second surface area is substantially equal to said first surface area.
22. An electronic module, the module comprising:
an insulating layer having a first surface and a second surface, said insulating layer comprising at least one core sheet, said at least one core sheet containing at least one glass-fibre mat and having at least one hole in said at least one glass-fibre mat;
at least one component within the insulating layer, said component having contact zones arranged towards the first surface and wherein at least a portion of the component is located within said at least one hole;
a first conductive-pattern layer arranged on the first surface of the insulating layer;
attachment areas between each of said at least one component and said first conductive-pattern layer;
at least one bonding layer between the at least one core sheet and the first conductive-pattern layer outside the attachment areas, said at least one bonding layer forming part of the insulating layer;
a hardened adhesive layer substantially within the attachment areas, said hardened adhesive layer forming part of the insulating layer; and
a plurality of feedthroughs penetrating the hardened adhesive layer and forming electrical contacts between the first conductive-pattern layer and at least a plurality of the contact zones of said at least one component;
wherein the at least one core sheet has a first coefficient of thermal expansion, the component has a second coefficient of thermal expansion lower than the first coefficient of thermal expansion and the filler material has a third coefficient of thermal expansion higher than the first coefficient of thermal expansion.