Method for manufacturing an electronic module in an installation base
View Patent ↗This publication discloses a method for manufacturing an electronic module, in which manufacture commences from an insulating-material sheet ( 1 ). At least one recess ( 2 ) is made in the sheet ( 1 ) and extends through the insulating-material layer ( 1 ) as far as the conductive layer on the opposite surface ( 1 a ). A component ( 6 ) is set in the recess, with its contact surface towards the conductive layer and the component ( 6 ) is attached to the conductive layer. After this, a conductive pattern ( 14 ) is formed from the conductive pattern closing the recess, which is electrically connected from at least some of the contact areas or contact protrusions of the component ( 6 ) set in the recess.
1. A method for manufacturing an electronic module, comprising:
taking a first sheet, which has a first surface and a second surface, and which first sheet includes an insulating-material layer between the first surface and the second surface, as well as a first conductive layer on the first surface,
making at least one first recess in the first sheet that extends through the second surface and the insulating-material layer as far as the first conductive layer, which covers the first recess from the direction of the first surface,
taking a first component having a contact surface with contact areas or contact protrusions,
placing the first component in the first recess with its contact surface facing the first surface,
attaching the first component to the first conductive layer by gluing with the aid of an electrically insulating adhesive,
forming a first conductive pattern from the first conductive layer and forming at least some first electrical contacts between the first component and the first conductive pattern through first feed-throughs, the first electrical contacts connecting at least some of the contact areas or contact protrusions of the first component electrically to the first conductive pattern,
making a second conductive layer on the second surface of the first sheet,
making at least one second recess in the first sheet, which extends through the first surface and the insulating-material layer as far as the second conductive layer, which covers the second recess from the direction of the second surface,
taking a second component having a contact surface with contact areas or contact protrusions,
placing the second component in the second recess, with its contact surface towards the second surface, and attaching the second component to the second conductive layer by gluing with the aid of a second electrically insulating adhesive, and
forming a second conductive pattern from the second conductive layer and forming at least some second electrical contacts between the second component and the second conductive pattern through second feed-throughs, the second electrical contacts connecting at least some of the contact areas or contact protrusions of the second component electrically to the second conductive pattern, wherein the first component and the second component comprise microcircuit chips.
2. A method according to claim 1 , wherein the first component attached to the first conductive layer is an unpacked microcircuit chip.
3. A method according claim 1 , wherein additional insulating layers and conductive layer are manufactured on at least one of the first surface and the second surface to create a multi-layer circuit-board structure.
4. A method according to claim 1 , wherein the at least some first electrical contacts are metal and metallurgically bond to at least some of the contact areas or contact protrusions of the first component and the first conductive pattern layer.
5. A method according to claim 1 , wherein the second electrically insulating adhesive is the same as the first electrically insulating adhesive.
6. A method according to claim 1 , wherein the attaching step further includes bringing the electrically insulating adhesive between the first component and the first conductive layer before inserting the first component in the first recess and allowing the electrically insulating adhesive to harden after inserting the first component in the first recess.
7. An electronic module, comprising:
a sheet, which has a first surface and a second surface, and which sheet includes an insulating-material layer between the first surface and the second surface,
a first conductive pattern layer on the first surface of the sheet,
at least one first recess in the sheet that extends through the second surface and the insulating-material layer as far as the first conductive pattern layer,
a first component having a first contact surface with contact areas or contact protrusions, the first component placed in the first recess with the first contact surface of the first component facing the first surface,
a first electrically insulating adhesive attaching the first component to the first conductive pattern layer on the first surface of the sheet, and
first connectors connecting at least some of the contact areas or contact protrusions of the first component electrically to the first conductive pattern layer through first feed-throughs,
a second conductive pattern layer on the second surface of the sheet,
a second component, having a second contact surface with contact areas or contact protrusions and placed in the insulating-material layer with the second contact surface facing the second conductive pattern layer,
a second electrically insulating adhesive attaching the second component to the second conductive pattern layer, and
second connectors connecting at least some of the contact areas or contact protrusions of the second component electrically to the second conductive pattern layer through second feed-throughs, wherein the first component and the second component comprise microcircuit chips.
8. The electronic module of claim 7 , wherein the first connectors are metal and form metallurgical bonds between at least some of the contact areas or contact protrusions of the first component and the first conductive pattern layer.
9. The electronic module of claim 7 , wherein at least one of the first and second component is an unpacked microcircuit chip.
10. The electronic module of claim 7 , comprising a further insulating layer and a further conductive layer on the first surface of the sheet.
11. The electronic module of claim 7 , wherein the second electrically insulating adhesive is the same as the first electrically insulating adhesive.
12. The electronic module of claim 7 , wherein at least a portion of the first electrically insulating adhesive is positioned between the first component and the first conductive layer.