Manufacture of a circuit board containing a component
View Patent ↗A method for the manufacture of a circuit board containing a component and circuit board containing a component. The invention is based on first manufacturing an intermediate product, which contains the insulator layer of the circuit board and the components, which are set in place inside the insulator layer in such a way that the contact elements of the components face the surface of the intermediate product. After this, the intermediate product is transferred to the circuit-board manufacturing line, on which a suitable number of conductor-pattern layers and, if necessary, insulator layers are manufactured on one or both sides of the intermediate product, in such a way that, when manufacturing the first conductor-pattern layer, the conductor material forms an electrical contact with the contact elements of the components. Alternatively, stages can also be performed on a single manufacturing line.
1. A method for manufacturing a circuit board from an intermediate product having an insulator layer and at least one component at least substantially inside the insulator layer, the at least one component comprising semiconductor material and contact elements in electrical contact with the semiconductor material, the intermediate product comprising a support membrane covering the contact, the method comprising:
removing the support membrane and revealing the contact elements facing towards the support membrane,
individually cleaning the surfaces of the contact elements by means of a laser for the creation of electrical contacts,
manufacturing a conductor-pattern layer on the surface of the insulator by growing the conductor-pattern layer directly in a correct shape by a growing method, in such a way that the conducting material of the conductor-pattern layer connects electrically to the contact elements of the component and the conductor-pattern layer has the correct shape,
simultaneously, with the manufacturing of the conductor-pattern layer, manufacturing a second conductor-pattern layer on the opposite side of the insulator layer, and
continuing manufacturing of the circuit board by making a number of alternating insulator layers and conductor-pattern layers on top of the conductor-pattern layers.
2. The method of claim 1 , wherein the manufacturing of the conductor-pattern layer directly in its correct shape comprises:
growing a thin seed layer of metal on both surfaces of the insulating-material layer,
spreading resist layers on the surfaces of the seed layers,
patterning the resist layers to form conductor-pattern masks,
growing a conductor material electrolytically in the areas from which the resist was removed,
removing the resist layers, and
removing the seed layers.
3. A method for manufacturing a circuit board from an intermediate product having an insulator layer and at least one component at least substantially inside the insulator layer, the at least one component having contact elements that are revealed substantially on the level of the surface of the insulator layer, the at least one component further comprising semiconductor material in electrical contact with the contact elements, the method comprising:
taking the intermediate product, in which the contact elements are revealed,
individually cleaning the surfaces of the contact elements by means of a laser for the creation of electrical contacts,
manufacturing a conductor-pattern layer on the surface of the insulator by growing the conductor-pattern layer directly in a correct shape by a growing method, in such a way that the conducting material of the conductor-pattern layer connects electrically to the contact elements of the component and the conductor-pattern layer has the correct shape,
simultaneously, with the manufacturing of the conductor-pattern layer, manufacturing a second conductor-pattern layer on the opposite side of the insulator layer, and
continuing manufacturing of the circuit board by making a number of alternating insulator layers and conductor-pattern layers on top of the conductor-pattern layers.
4. The method of claim 3 , wherein the manufacturing of the conductor-pattern layer directly in its correct shape comprises:
growing a thin seed layer of metal on both surfaces of the insulating-material layer,
spreading resist layers on the surfaces of the seed layers,
patterning the resist layers to form conductor-pattern masks,
growing a conductor material electrolytically in the areas from which the resist was removed,
removing the resist layers, and
removing the seed layers.
5. A method for manufacturing a circuit board, the circuit board containing at least one conductor-pattern layer and at least one component electrically connected thereto, which is located at least substantially inside the insulator layer of the circuit board, the at least one component comprising semiconductor material and contact elements in electrical contact with the semiconductor material, the method comprising:
taking a support,
attaching the at least one component to the support,
manufacturing the insulator layer on the surface of the support, around each attached component,
removing the support and revealing the contact elements of the component,
individually cleaning the surfaces of the contact elements by means of a laser for the creation of electrical contacts,
manufacturing a conductor-pattern layer on the surface of the insulator by growing the conductor-pattern layer directly in a correct shape by a growing method, in such a way that the conductor material of the conductor-pattern layer connects electrically to the contact elements of the component and the conductor-pattern layer has the correct shape,
simultaneously, with the manufacturing of the conductor-pattern layer, manufacturing a second conductor-pattern layer on the opposite side of the insulator layer, and
continuing manufacturing of the circuit board by making a number of alternating insulator layers and conductor-pattern layers on top of the conductor-pattern layers.
6. The method of claim 5 , wherein manufacturing of the conductor-pattern layer directly in its correct shape comprises
growing a thin seed layer of metal on both surfaces of the insulating-material layer,
spreading resist layers on the surfaces of the seed layers,
patterning the resist layers to form conductor-pattern masks,
growing a conductor material electrolytically in the areas from which the resist was removed,
removing the resist layers, and
removing the seed layers.
7. The method of claim 5 , wherein the support is a support membrane.
8. The method of claim 5 , wherein the support is a support surface.