Method for fabrication of an electronic module and electronic module
View Patent ↗The present invention concerns an electronic module with at least one component embedded in insulating material. The electronic module comprises a first insulating material having a first surface and a second surface and a thickness between the first surface and the second surface, at least one opening through the first insulating material, a second insulating material on the second surface of the first insulating material, at least one component embedded in the second insulating material, at least one conductive pattern in the at least one opening, the at least one conductive pattern having a first surface and a second surface, wherein the second surface faces the second insulating material and the first surface faces away from the second insulating material and a distance between the first surface of the first insulating material and the second surface of the at least one conductive pattern is less or greater than the thickness of the first insulating material, an adhesive between the first insulating material and the at least one component, and connection elements between the at least one conductive pattern and the at least one component. The present invention further concerns a method for fabrication of an electronic module with at least one component embedded in an insulating layer.
1. A method for fabrication of an electronic module with at least one component embedded in an insulating layer, the method comprising:
a) arranging a release layer on a first surface of a conductive foil,
b) arranging a first resist layer with pattern and/or via openings on top of the release layer and growing conductor material, the thickness of the first resist layer being greater or less than the thickness of the conductor material being grown,
c) arranging an adhesive on top of or on top of a part of the resist layer and the conductor material being grown or on a contacting surface of at least one component, which has contact zones,
d) placing the at least one component in such a way that the contacting surface faces towards a second surface of the resist layer and the positions of the contact zones coincide with the positions of the via openings,
e) arranging an insulating layer in such a way that the at least one component is embedded in the insulating layer,
f) removing the conductive foil and the release layer, and
g) removing material from the via openings, thus forming via holes, and growing of conductor material in the via holes subsequent to placing the at least one component, thus electrically contacting the conductor material and the at least one component.
2. The method for fabrication of an electronic module according to claim 1 , wherein an additional polymeric layer is made between the first resist layer and the adhesive.
3. The method for fabrication of an electronic module according to claim 1 , wherein a second resist layer with pattern and via openings is arranged after step b) in such a way that a first surface of the second resist layer faces towards the first resist layer and conductor material is grown, the thickness of the second resist layer being greater or less than the thickness of the conductor material being grown.
4. The method for fabrication of an electronic module according to claim 1 , wherein
a second resist layer with pattern and via openings is arranged after step b) in such a way that a first surface of the second resist layer faces towards the first resist layer and conductor material is grown, the thickness of the second resist layer being greater or less than the thickness of the conductor material being grown, and
after arranging a second resist layer an additional polymeric layer is made between a second surface of the second resist layer and the adhesive.
5. An electronic module comprising:
a first insulating material having a first surface, a second surface and a thickness between the first and second surface,
an opening through the first insulating material,
a second insulating material on at least a portion of the second surface of the first insulating material,
a component at least partially embedded in the second insulating material and electrically coupled to a conductive pattern,
a third insulating material between the component and the first insulating material,
wherein the conductive pattern is at least partially within said opening and the conductive pattern has a first surface opposite a second surface,
wherein the second surface of the conductive pattern faces the second insulating material and a distance between the first surface of the first insulating material and the second surface of the conductive pattern is less or greater than the thickness of the first insulating material, and
wherein connection elements in via holes are arranged between the conductive pattern and the component through the third insulating material, via the via holes coinciding with positions of contact zones of the component.
6. The electronic module of claim 5 , wherein the component is electrically coupled to the conductive pattern by connection elements including conductive material deposited in a via hole in the first or second insulating material.
7. The electronic module of claim 5 , wherein there is an adhesive layer in between the first and second insulating materials.
8. The electronic module according to claim 5 , wherein the second insulating material on the second surface of the first insulating material includes a polymeric layer.
9. The electronic module according to claim 5 , wherein a distance between the first surface of the first insulating material and the first surface of the at least one conductive pattern is greater than zero.
10. The electronic module according to claim 5 , wherein the conductive pattern is arranged on the second insulating material.
11. An electronic module comprising:
a first insulating material layer having an opening therein,
a second insulating material layer coupled to the first insulating material layer,
a component at least partially embedded within the second insulating material layer at a position at least partially overlapping with the opening in the coupled first insulating material layer,
a third insulating material layer between the component and the first insulating material layer,
a conductive pattern layer at least partially within the opening of the first insulating material layer and electrically coupled to the component, wherein a thickness of the conductive pattern layer is less than a thickness of the first insulating material layer, and
connection elements in via holes arranged between the conductive pattern layer and the component through the third insulating material, the via holes coinciding with positions of contact zones of the component.
12. An electronic module according to claim 11 , further comprising an adhesive layer between, and coupling, the first and second insulating material layers.
13. An electronic module according to claim 12 , wherein the conductive pattern layer partially extends out of the opening in the first insulating material layer and in to the adhesive layer.
14. An electronic module according to claim 12 , wherein the adhesive layer extends partially within the opening in the first insulating material layer.
15. An electronic module according to claim 12 , further comprising a via in the adhesive layer through which the component is electrically coupled to the conductive layer.
16. An electronic module according to claim 12 , wherein the component is entirely embedded within the second insulating material layer and the adhesive layer.
17. An electronic module according to claim 11 , wherein the component is entirely embedded within the second insulating material layer.
18. An electronic module according to claim 11 , wherein at least two components are at least partially embedded within the second insulating material layer, the at least two components are at a position which corresponds with the opening in the first insulating material layer, and the at least two components are electrically connected to the conductive pattern layer.
19. An electronic module according to claim 11 , wherein the conductive pattern layer is in the same plane with the first insulating material layer, and wherein at least one surface of the conductive pattern layer is not flush with the corresponding surface of the first insulating material layer.
20. An electronic module according to claim 19 , wherein the non flush surfaces of the conductive pattern layer and first insulating material layers are the surfaces at or nearest to the interface with the second insulating material layer.