Method for embedding a component in a base
View Patent ↗This publication discloses a method, in which the semiconductor components forming part of an electronic circuit, or at least some of them, are embedded in a base, such as a circuit board, during the manufacture of the base, when part of the base structure is, as it were, manufactured around the semiconductor components. According to the invention, through-holes for the semiconductor components are made in the base, in such a way that the holes extend between the first and second surface of the base. After the making of the holes, a polymer film is spread over the second surface of the base structure, in such a way that the polymer film also covers the through-holes made for the semiconductor components from the side of the second surface of the base structure. Before the hardening, or after the partial hardening of the polymer film, the semiconductor components are placed in the holes made in the base, from the direction of the first surface of the base. The semiconductor components are pressed against the polymer film in such a way that they adhere to the polymer film. After this, the final hardening of the polymer film is carried out.
1. A method for embedding at least one component in a base, which component has contact areas on its first surface, the method comprising
taking a baseboard of the base, the baseboard having a first surface and a second surface,
making conductive patterns on the baseboard and at least one hole for the at least one component, in such a way that each hole extends through the baseboard between the first surface and the second surface,
spreading an insulating polymer layer on the second surface of the baseboard, in such a way that the insulating polymer layer covers the at least one hole made for the component,
placing the at least one component in the at least one hole, in such a way that the component is aligned in relation to the conductive patterns made on the baseboard and the first surface of the component presses against the insulating polymer layer, and
hardening the insulating polymer layer.
2. A method according to claim 1 , in which the first surface of the component is pressed into the unhardened insulating polymer layer.
3. A method according to claim 1 , in which the first surface of the component is pressed into the partly hardened insulating polymer layer.
4. A method according to any of claims 1 - 3 , in which the insulating polymer layer is manufactured by placing an RCC foil on the second surface of the baseboard.
5. A method according to any of claims 1 - 3 , in which the insulating polymer layer is manufactured by spreading a pre-preg epoxy film on the second surface of the baseboard.
6. A method according to claim 1 , in which conducting material is grown on the side walls of the hole made for the component, in order to create interference protection around the component.
7. A method according to claim 1 , in which the contact areas of the component have contact protrusions connected to them, and the component is placed in the hole in such a way that the contact protrusions push inside the insulating polymer layer.
8. A method according to claim 1 , in which the contact areas of the component have contact protrusions connected to them, the height of the contact protrusions being at least as great as the thickness of the insulating polymer layer, and the component is placed in the hole in such a way that the contact protrusions penetrate through the insulating polymer layer.
9. A method according to claim 1 , in which
contact openings for the component are made in the hardened insulating polymer layer, and
conductors for forming electrical contacts with the component are made in the contact openings and on top of the insulating polymer layer.
10. A method according to claim 1 , in which conductive patterns are made on at least the second surface ( 1 b ) of the baseboard, and in which the insulating polymer layer to be spread on the second surface ( 1 b ) of the baseboard is spread in such a way that it covers the conductive patterns made on the second surface ( 1 b ).
11. A method according to claim 1 , in which the first surface of the component is pushed into the insulating polymer layer, which is in contact with the conductive patterns, which are formed from the conductive layer.
12. A method according to claim 1 , in which at least one set of conductive patterns are located between the insulating polymer layer, against which the first surface of the component is pushed, and the baseboard of the circuit board.
13. A method according to claim 1 , in which the baseboard is of an insulating material.
14. A method according to claim 1 , in which the component is secured in place in the at least one hole made for the component by filling the hole with a filler material.
15. A method according to claim 1 , in which the component is a microcircuit and an electrical contact is formed with the microcircuit from the direction of the first surface of the baseboard, after the microcircuit has been placed in the hole made in the baseboard.
16. A method according to claim 1 , in which an electrical contact is formed with the component by growing conductive material in the contact areas of the component.
17. A method according to claim 15 , in which the electrical contact with the microcircuit is formed without solder using a circuit-board manufacturing technology.
18. A method according to claim 1 , comprising making a plurality of holes in the baseboard for a plurality of components to be embedded in the base, and embedding each of said components in a separate hole of said plurality of holes.
19. A method according to any of claim 1 , in which a multi-layer structure is manufactured, in which there are at least four conductive layers on top of each other.
20. A method according to claim 1 , wherein at least two microcircuits are embedded in the base, and wherein at least one second base, in which at least two microcircuits are embedded, is manufactured, and the bases are assembled and secured on top of each other in such a way that the bases are aligned in relation to each other.
21. A method according to claim 1 , in which
a first and a second base and an intermediate layer are manufactured,
the second base is placed above the first base and the second base is aligned in relation to the first base,
the intermediate layer is placed between the first and the second bases, and
the first and second bases are laminated to each other with the aid of the intermediate layer.
22. A method according to claim 21 , in which
at least one third base and an intermediate layer for every third base are manufactured,
each third base is placed in turn above the first and second bases and each third base is aligned in relation to one of the lower bases,
an intermediate layer is placed beneath each third base, and
the first, second, and each third base are laminated to each other with the aid of the intermediate layers.
23. A method according to any of claims 20 - 22 , in which holes for feed-throughs are drilled through the bases secured on top of each other and conductors are made in the drilled holes for connecting the electronic circuits of each base to each other to form an operational totality.
24. A method according to claim 1 , in which the temperature of the baseboard, component, and conductive layer connected directly to the component, is, during the process, less than 200° C.
25. An electronic module, which is manufactured using the method of claim 1 .
26. The method according to claim 1 , in which the contact areas of the component have contact protrusions connected to them, and an electrical contact is formed with the component by growing conductive material on top of the contact protrusions.
27. The method according to claim 1 , in which the temperature of the baseboard, component, and conductive layer connected directly to the component, is in the range 20-85° C. during the process.
28. The electronic module of claim 25 , comprising
the baseboard having the first surface and the second surface,
the conductive patterns on the baseboard and the at least one hole for the at least one component, wherein the at least one hole extends through the baseboard between the first surface and the second surface,
the hardened insulating polymer layer on the second surface of the baseboard, the insulating polymer layer covering the at least one hole made for the component,
the at least one component in the at least one hole, the at least one component having contact areas on its first surface and the first surface of the component being against the hardened insulating polymer layer.
29. The electronic module of claim 25 , comprising
conducting material on the side walls of the at least one hole for the at least one component, in order to create interference protection around the component.
30. The electronic module of claim 25 , comprising
contact openings for the component in the hardened insulating polymer layer, and
conductors for forming electrical contacts with the component in the contact openings and on top of the hardened insulating polymer layer.
31. The electronic module of claim 25 , wherein the at least one component is at least one microcircuit.
32. The electronic module of claim 25 , comprising a plurality of holes in the baseboard and a plurality of components embedded each in the individual ones of said plurality of holes.
33. The electronic module of claim 25 , comprising at least four conductive layers.
34. The electronic module of claim 25 , comprising at least two bases each having at least one component embedded therein and said bases being secured on top of each other.
35. The electronic module of claim 26 , wherein at least one of the bases has at least two microcircuits embedded therein.
36. The electronic module of claim 25 , comprising at least one intermediate layer between said at least two bases secured on top of each other.
37. The electronic module of claim 25 , comprising feed-throughs for electrically connecting the components of the bases to each other.