Electric module having a conductive pattern layer

1. An electronic module, comprising:

a conductive-pattern layer;

an insulating-material layer supporting the conductive-pattern layer;

at least one component inside the insulating-material layer, the at least one component comprising a first surface and contact zones on the first surface;

a first hardened adhesive layer on the first surface of the at least one component;

a second hardened adhesive layer in contact with the conductive-pattern layer and the first hardened adhesive layer;

holes in the first and second hardened adhesive layer at the locations of the contact zones; and

conductive material in the holes and in electrical connection with the contact zones of the component and the conductive-pattern layer,

wherein the first hardened adhesive layer has a first composition and the second hardened adhesive layer has a second composition different from the first composition.

2. The electronic module of claim 1 , wherein the second hardened adhesive layer covers the conductive-pattern layer such that the insulating-material layer supports the conductive-pattern layer via said second hardened adhesive layer.

3. The electronic module of claim 1 , wherein the first and second hardened adhesive layers are local and present at the location of the component such that the insulating-material layer directly supports the conductive-pattern layer.

4. An electronic module, comprising:

at least one semiconductor component comprising a first surface and a set of contact zones on the first surface;

a first hardened adhesive layer on the first surface;

a second hardened adhesive layer at least on the first hardened adhesive layer;

contact elements made of metal on the set of contact zones, the contact elements extending through the first and second hardened adhesive layers;

conductors in contact with the contact elements and forming a conductive-pattern layer; and

an insulating-material layer around the at least one semiconductor component,

wherein the first hardened adhesive layer has a first composition and the second hardened adhesive layer has a second composition different from the first composition.

5. The electronic module of claim 4 , wherein the at least one semiconductor component comprises at least one microcircuit.

6. The electronic module of claim 4 , wherein the area of the first hardened adhesive layer is equal to the area of the first surface of the at least one semiconductor component.

7. The electronic module of claim 4 , wherein the area of the first hardened adhesive layer is greater than the area of the second hardened adhesive layer.

8. The electronic module of claim 4 , wherein the contact elements comprise a first layer of metal and at least one second layer of metal.

9. The electronic module of claim 4 , wherein the contact elements are in metallurgical contact with the respective contact zones and the respective conductors.