Circuit module and method of manufacturing the same
View Patent ↗Manufacturing method and circuit module, which comprises an insulator layer and, inside the insulator layer, at least one component, which comprises contact areas, the material of which contains a first metal. On the surface of the insulator layer are conductors, which comprise at least a first layer and a second layer, in such a way that at least the second layer contains a second metal. The circuit module comprises contact elements between the contact areas and the conductors for forming electrical contacts. The contact elements, for their part, comprise, on the surface of the material of the contact area, an intermediate layer, which contains a third metal, in such a way that the first, second, and third metals are different metals and the contact surface area (A CONT 1 ), between the intermediate layer and the contact area is less that the surface area (A PAD ) of the contact area.
1. A circuit module, comprising
an insulator layer;
at least one first component inside the insulator layer, the at least one first component comprising first contact terminals with contact surfaces of first metal;
at least one second component inside the insulator layer, the at least one second component comprising second contact terminals with contact surfaces of second metal different from the first metal;
conductors on a surface of the insulator layer, the conductors comprising at least a first layer of copper and a second layer of copper;
first contact elements for forming first electrical contacts between the first contact terminals and the conductors, the first contact elements comprising an intermediate layer on each contact surface of the first contact terminal, the intermediate layer containing a third metal different from the first metal, a contact surface area (A CONT 1 ) between the intermediate layer and the contact terminal being less than a surface area (A PAD ) of the contact surface of the first contact terminal; and
second contact elements for forming second electrical contacts between the second contact terminals and the conductors, a contact surface area (A CONT 1 ) between each second contact element and the respective second contact terminal being less than a surface area (A PAD ) of the contact surface of the second contact terminal.
2. The circuit module of claim 1 , wherein the second contact elements comprise an intermediate layer on each contact surface of the second contact terminal, the intermediate layer containing a fourth metal different from the second metal.
3. The circuit module of claim 1 , wherein the first metal is aluminium.
4. The circuit module of claim 3 , wherein the third metal comprises at least one of zinc and nickel.
5. The circuit module of claim 1 , wherein the second metal is copper.
6. The circuit module of claim 1 , wherein the first metal is aluminium and the second metal is copper.
7. The circuit module of claim 6 , wherein the third metal comprises at least one of zinc and nickel.
8. The circuit module of claim 1 , wherein the intermediate layer extends along the side walls of the first contact elements between the first contact terminals and the conductors.
9. The circuit module of claim 1 , wherein each contact element comprises a copper core, which connects continuously to the material of the second layer of the conductors.
10. The circuit module of claim 1 , wherein the conductors comprise
a first layer of copper on the surface of the insulator layer; and
a second layer of copper on the surface of the first copper layer.
11. The circuit module of claim 1 , wherein the conductors comprise
a first layer of copper on the surface of the insulator layer;
an intermediate layer on the surface of the first copper layer; and
a second layer of copper on the surface of the intermediate layer.
12. The circuit module of claim 1 , wherein a width (W CONT ) of the contact surface between the contact element and the contact terminal of the component is 0-20% less than a greatest width (W MAX ) of the contact element in the same direction.
13. The circuit module of claim 1 , wherein a height (H) of the contact element is less than, or equal to a greatest width (W MAX ) of the contact element.
14. A circuit module, comprising
an insulator layer;
at least one first component inside the insulator layer, the at least one first component comprising first contact terminals with contact surfaces made of aluminium;
at least one second component inside the insulator layer, the at least one second component comprising second contact terminals with contact surfaces made of copper;
conductors on a surface of the insulator layer, the conductors comprising at least a first layer of copper and a second layer of copper;
first contact elements for forming first electrical contacts between the first contact terminals and the conductors, the first contact elements comprising an intermediate layer on each contact surface of the first contact terminal, a contact surface area (A CONT 1 ) between the intermediate layer and the contact terminal being less than a surface area (A PAD ) of the contact surface of the first contact terminal; and
second contact elements between the second contact terminals and the conductors for forming second electrical contacts, a contact surface area (A CONT 1 ) between each second contact element and the respective second contact terminal being less than a surface area (A PAD ) of the contact surface of the second contact terminal.
15. The circuit module of claim 14 , wherein the intermediate layer comprises at least one of zinc and nickel.
16. The circuit module of claim 14 , wherein the first contact terminals are contact areas on a surface of a semiconductor component, a surface of each contact area revealed in an opening made in a passivation layer made on the surface of the semiconductor component.
17. The circuit module of claim 14 , wherein the second contact terminals are contact bumps made on contact areas on a surface of a semiconductor component.
18. The circuit module of claim 14 , wherein the second contact terminals are contact areas on a surface of a semiconductor component, a surface of each contact area revealed in an opening made in a passivation layer made on the surface of the semiconductor component.
19. A circuit module, comprising
an insulator layer;
at least one first semiconductor component inside the insulator layer, the at least one first semiconductor component comprising first contact terminals, the first contact terminals being contact areas on a surface of the semiconductor component, a surface of each contact area revealed in an opening made in a passivation layer made on the surface of the semiconductor component;
at least one second semiconductor component inside the insulator layer, the at least one second semiconductor component comprising second contact terminals, the second contact terminals being contact bumps made on contact areas on a surface of the semiconductor component;
conductors on a surface of the insulator layer, the conductors comprising at least a first layer of copper and a second layer of copper;
first contact elements for forming first electrical contacts between the first contact terminals and the conductors, the first contact elements comprising an intermediate layer on each contact surface of the first contact terminal, the intermediate layer containing a metal different from a metal of the first contact terminal, a contact surface area (A CONT 1 ) between the intermediate layer and the contact terminal being less than a surface area (A PAD ) of the contact surface of the first contact terminal; and
second contact elements for forming second electrical contacts between the second contact terminals and the conductors, a contact surface area (A CONT 1 ) between each second contact element and the respective second contact terminal being less than a surface area (A PAD ) of the contact surface of the second contact terminal.
20. The circuit module of claim 19 , wherein the metal of the first contact terminal is aluminium and the intermediate layer comprises at least one of zinc and nickel.