Method for manufacturing an electronic module
View Patent ↗This publication discloses a method for manufacturing an electronic module, in which manufacture commences from an insulating-material sheet ( 1 ). At least one recess ( 2 ) is made in the sheet ( 1 ) and extends through the insulating-material layer ( 1 ) as far as the conductive layer on the opposite surface ( 1 a ). A component ( 6 ) is set in the recess, with its contact surface towards the conductive layer and the component ( 6 ) is attached to the conductive layer. After this, a conductive pattern ( 14 ) is formed from the conductive pattern closing the recess, which is electrically connected from at least some of the contact areas or contact protrusions of the component ( 6 ) set in the recess.
1. An electronic module comprising:
a first element comprising
a first insulating-material layer having a first surface and a second surface, and a first thickness between the first surface and the second surface;
a first recess in the first insulating-material layer;
a first component in the first recess, the first component having a first height greater than the first thickness;
a first conductive pattern layer on the first surface and electrically connected to the first component; and
a second conductive pattern layer on the second surface, the first component extending through the second conductive pattern layer;
a second element coupled to the first element, the second element comprising
a second insulating-material layer having a third surface and a fourth surface, and
a second thickness between the third surface and the fourth surface;
a second recess in the second insulating-material layer;
a second component in the second recess, the second component having a second height greater than the second thickness;
a third conductive pattern layer on the third surface and electrically connected to the second component; and
a fourth conductive pattern layer on the fourth surface;
a third insulating-material layer between the second conductive pattern layer and the fourth conductive pattern layer, wherein the third insulating-material layer fills space between the first element and the second element, and
wherein an upper surface of the first component is higher than an upper surface of the second conductive pattern layer.
2. The electronic module of claim 1 , further comprising insulating material in the first recess and the second recess.
3. The electronic module of claim 2 , wherein the insulating material fills space in the first recess and in the second recess around the first component and the second component.
4. The electronic module of claim 1 , wherein the first element further comprises multiple components.
5. The electronic module of claim 1 , wherein the electronic module further comprises a plurality of additional components disposed in at least one of the first element and the second element.
6. The electronic module of claim 5 , wherein at least one of the plurality of additional components is different from another of the plurality of additional components.
7. The electronic module of claim 1 , wherein the first component is an active component having an active surface facing the first conductive pattern layer.
8. The electronic module of claim 7 , wherein the second component is an active component having an active surface facing the third conductive pattern layer, whereby the active surfaces of the first component and the second component face opposite directions.
9. The electronic module of claim 1 , further comprising a first layer of electrically insulating adhesive mechanically attaching the first component to the first conductive pattern layer.
10. The electronic module of claim 1 , further comprising a second layer of electrically insulating adhesive mechanically attaching the second component to the third conductive pattern layer.
11. The electronic module of claim 1 , wherein the first insulating material layer is of a first insulating material, the second insulating-material layer is of a second insulating material, and the third insulating-material layer is of a third insulating material different from the first insulating material and the second insulating material.
12. The electronic module of claim 1 , wherein the first insulating material layer and the second insulating-material layer both comprise epoxy with glass-fibre reinforcement, and the third insulating-material layer comprises at least epoxy.
13. The electronic module of claim 1 , wherein the first component has first contact areas facing the first conductive pattern layer and the electronic module comprises first contact elements metallurgically and electrically connecting at least some of the first contact areas to the first conductive pattern layer.
14. The electronic module of claim 1 , wherein the second component has second contact areas facing the third conductive pattern layer and the electronic module comprises second contact elements metallurgically and electrically connecting at least some of the second contact areas to the third conductive pattern layer.