Patent Assignment
Reel/Frame 034932/0630
Assignment of Assignor's Interest
Recorded: 2015-02-10
Pages: 3
Assignor
CHEN, CHI-HAN
Executed: 2015-01-27
Assignee
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
26 CHIN 3RD ROAD, NANTZE EXPORT PROCESSING ZONE, KAOHSIUNG, TAIWAN
Covered Property
(1)
Semiconductor Package Structure and Semiconductor Manufacturing Process