Patent Assignment
Reel/Frame 034944/0874
Assignment of Assignor's Interest
Recorded: 2015-02-12
Pages: 6
Assignors
KIM, JU-YOUN
Executed: 2014-01-18
JANG, HYUNG-SOON
Executed: 2014-01-18
YOUN, JONG-MIL
Executed: 2014-01-18
HA, TAE-WON
Executed: 2014-01-18
Assignee
SAMSUNG ELECTRONICS CO., LTD
129 SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, 443-742, KOREA, REPUBLIC OF
Covered Property
(1)
High Integration Semiconductor Device and Method for Fabricating the Same