Patent Assignment
Reel/Frame 034957/0198
Assignment of Assignor's Interest
Recorded: 2015-02-13
Pages: 6
Assignors
NOH, HYUN-PIL
Executed: 2015-01-29
KIM, JEONG-WOON
Executed: 2015-01-29
LEE, SEOK-HA
Executed: 2015-01-29
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 443-742, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Chip, Semiconductor Package and Fabricating Method Thereof