Patent Assignment
Reel/Frame 034962/0959
Assignment of Assignor's Interest
Recorded: 2015-02-13
Pages: 5
Assignors
SHU, MIN-FONG
Executed: 2015-02-09
TSENG, YI-HSIU
Executed: 2015-02-05
CHEN, KUAN-NENG
Executed: 2015-02-05
KUO, SHU-CHIAO
Executed: 2015-02-05
Assignee
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
26 CHIN 3RD ROAD, NANTZE EXPORT PROCESSING ZONE, KAOSIUNG, TAIWAN
Covered Property
(1)
Sloped Bonding Structure for Semiconductor Package