Patent Assignment
Reel/Frame 034973/0818
Assignment of Assignor's Interest
Recorded: 2015-02-17
Received: 2015-02-17
Pages: 3
Assignee
STATS CHIPPAC, LTD.
10 ANG MO KIO STREET 65, #05-17/20 TECHPOINT, SINGAPORE, SGX, 569059, SINGAPORE
Covered Properties
(2)
Semiconductor Device and Method of Forming Build-Up Interconnect Structures Over a Temporary Substrate
Application:
14/624,136 →
Filter Using Film Bulk Acoustic Resonator and Transmission/Reception Switch
Application:
10/476,218 →