IP Library Assignment 034973/0818
Patent Assignment
Reel/Frame 034973/0818

Assignment of Assignor's Interest

Recorded: 2015-02-17 Received: 2015-02-17 Pages: 3
Assignors
CHEN, KANG
Executed: 2015-02-16
LIN, YAOJIAN
Executed: 2015-02-16
Assignee
STATS CHIPPAC, LTD.
10 ANG MO KIO STREET 65, #05-17/20 TECHPOINT, SINGAPORE, SGX, 569059, SINGAPORE
Covered Properties (2)
Semiconductor Device and Method of Forming Build-Up Interconnect Structures Over a Temporary Substrate
Application: 14/624,136 →
Filter Using Film Bulk Acoustic Resonator and Transmission/Reception Switch
Application: 10/476,218 →