IP Library › Assignment 034974/0496
Patent Assignment
Reel/Frame 034974/0496

Assignment of Assignor's Interest

Recorded: 2015-02-17 Pages: 7
Assignors
LHOSTIS, SANDRINE
Executed: 2014-09-17
KOKSHAGINA, OLGA
Executed: 2014-12-16
BEILLIARD, YANN
Executed: 2014-09-12
FIORI, VINCENT
Executed: 2014-09-17
Assignees
STMICROELECTRONICS SA
29, BOULEVARD ROMAIN ROLLAND, MONTROUGE, F-92120, FRANCE
STMICROELECTRONICS (CROLLES 2) SAS
850, RUE JEAN MONNET, CROLLES, F-38926, FRANCE
Covered Property (1)
Device Comprising a Three-Dimensional Integrated Structure with Simplified Thermal Dissipation, and Corresponding Fabrication Method
Patent: 9,449,896 →
Application: 14/590,404 →
Publication: US 2015/0200151
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jul 11, 2022
From: STMICROELECTRONICS SA
To: STMICROELECTRONICS INTERNATIONAL N.V.
Reel/Frame 060620/0769 →
Assignment of Assignor's Interest Aug 11, 2022
From: STMICROELECTRONICS (CROLLES 2) SAS
To: STMICROELECTRONICS INTERNATIONAL N.V.
Reel/Frame 060784/0143 →